Telit Unveils Bluetooth 5 Module at Mobile World Congress 2017

Telit, a global enabler of the Internet of Things (IoT), today introduced the Bluetooth Low Energy (BLE) BlueMod+S50 single mode module. This marks the industry’s first introduction of a standalone and certified, Bluetooth® 5 compliant module with a compelling mix of future-proof features designed to extend product lifecycles. Building on the success of the Telit BlueMod family of Bluetooth modules and complete integrated set of IoT Products and services, the BlueMod+S50 is key to bringing low power, “connectionless” IoT designs and services to market quickly.

The new BlueMod+S50 module from Telit marks an industry milestone. Now, developers can adopt this cutting-edge technology into use cases not possible with previous generations of Bluetooth, such as full in-building connections. The latest Bluetooth 5 specification offers significant updates with quadruple range and speeds that are twice as fast, while increasing the capacity of connectionless data broadcasts by 800%. Always a step ahead, Telit incorporated additional features such as secure, integrated NFC (Near Field Communication) capability and support for most GATT based Client and Server profiles.

“What makes the BlueMod+S50 so compelling is the combination of industry’s latest silicon with Telit’s state of the art engineering for an overall richer, more intelligent user experience,” said Felix Marchal, Executive Vice President of GNSS and Short Range Wireless. “We take it a step further with our ‘design once, use anywhere’ philosophy by including resources from the Telit IoT Know How program—assisting customers holistically with deployment of completion solutions from idea to market. The new module is not only swappable with previous generations of our Bluetooth line, it includes enhancements that benefit verticals which depend on advanced, forward-thinking technology like smart home and healthcare.”

Key Features and Benefits:
· Generic GATT Client and Server: Simplifies configuration
· Terminal I/O: Enables fast and reliable transport of data/ protocols transparently over Bluetooth
· NFC Handover: Eliminates manual interaction, delivering a nearly instant and most important—secure connection.
· Reliable line-of-sight range: over 800* meters. (*250m with Android phone and iPhone).
· Ultra-Low power: Proprietary UICP (UART Interface Control Protocol) further reduces power consumption of the module by 30-100 times compared to non UICP operations.

The BlueMod+S50 delivers industry-leading low power consumption and is well suited for many verticals including home automation, healthcare, telematics, asset management, routers and gateways, retail, and smart cities in addition to battery dependent devices with long product lifecycles. Designers can integrate the module without additional hardware via a robust choice of interfaces, including GPIO, ADC, UART, SPI, and others.

The new module is being fast tracked to address market demand for advanced, low-power wireless networking technology. It is the company’s latest addition to the Advanced Edge Technology portfolio that supports Bluetooth, Short range, GNSS, Wi-Fi, LoRa, and LPWA. As device makers are looking to develop IoT solutions that remain relevant for years to come, they are eager to adopt future-proof solutions. ABI Research forecasts Bluetooth-enabled device shipments over the next five years will increase by an average of half a billion per year through 2021, reaching more than five billion.

Learn more about the new BlueMod+S50 module in Telit’s booth at Mobile World Congress 2017, located at hall 5 stand E61 and also at http://info.telit.com/bluemods50.

* Samples, evaluation and development kits available in the second half of 2017.

Telit adds Wi-Fi and low-power solutions for IoT with acquisition of GainSpan to extend end-to-end IoT solutions reach

Telit, a global enabler of the Internet of Things (IoT), today announced that it has agreed to acquire Silicon Valley-based GainSpan Corporation (“GainSpan”). GainSpan is a wireless connectivity solution provider that specializes in the design and development of ultra-low power Wi-Fi technology. The company manufactures and commercializes chips and modules for battery-powered devices and related intellectual property (IP) with embedded software, including network stacks and application reference designs. GainSpan has over 90 employees, mostly R&D and application and support engineers, spread across an R&D center in Bangalore, India and San Jose, California.

“As we enter an era of maturity for the IoT, we are starting to witness the appearance of spaces within it such as the Internet of Sensors, the Internet of Cars, and the Internet of Digital,” said Oozi Cats, CEO of Telit. “With few exceptions, the ability to cut the power cord is an essential growth engine for all these branches of the IoT.”

According to the September 2016 “IoT Forecasts” from Machina Research, by 2025 about 75% of the more than 27 billion IoT connections will be short range, which is largely comprised of the various types of Wi-Fi. Wi-Fi is a leading technology for applications within the IoT that are battery-dependent, due to the low-power consumption associated with the technology.

The new business addition positions Telit to expand its complete end-to-end IoT solutions portfolio and address the growing market of battery-powered devices that rely on Wi-Fi and other low-power technologies. GainSpan products are situated at the intersection of several emerging segments in IoT such as healthcare, building management, cold-chain logistics, and a wide range of commercial and industrial application areas. GainSpan’s top-tier customer base leverage the company’s IP to deliver seamless integration of Wi-Fi with low-power technologies like BLE and 6LoWPAN for reliable, secure connectivity.

“The acquisition of GainSpan brings to Telit a world-class portfolio and a proven track record of Wi-Fi and low-power module solutions trusted by tier-one customers,” continued Oozi Cats. “Combined with our existing strength in delivering the most comprehensive, relevant portfolio of products and solutions for the IoT, this addition positions us well for future growth in our target segments, including security and surveillance, home automation, healthcare, asset management, and smart cities.”

Assets from GainSpan align well with existing Telit products including cellular, BT/BLE, GNSS modules; IoT connectivity and platform services, strengthening the company’s “sensor-to-cloud” solution proposition. The integration of the unique variety of low-power Wi-Fi technology from GainSpan, with low standby current and fast wake-up time into the Telit portfolio enables customers to extend the battery life of their devices for years*. GainSpan IP also offloads Wi-Fi services and networking functionality from the application. Customer devices can be designed with a simple and inexpensive MCU or without one at all.

Telit launches its Advanced Internet of Things (IoT) Modules for the India market

Telit Communications PLC (AIM:TCM), a global enabler of the Internet of Things (IoT), announced the launch of its advanced portfolio of LTE Cat.1 (IoT) modules in India. The CAT-1 module series serves customers requiring a mid-speed, low-power, long life-cycle mobile data solution for new or existing cellular-connected devices.

With Telit’s flagship LTE CAT-1 modules the Telecom providers in India would find it much easier to embrace the IoT revolution. These modules would help customers solve their wireless needs as they move their IoT solutions from 2G to 4G LTE networks. It helps deliver network based solutions with cost savings and longevity to bring today’s IoT products in to the future.

Mr. KyungJun Lee, Senior Director Marketing Telit APAC said, “Telit is a global leader in IoT technologies and offers the widest spectrum of IoT communication modules, IoT Connectivity and IoT Platform in the industry. The application of IoT in various fields within India has seen innumerable benefits for both the service providers and customers. These have been achieved at a minimal cost coupled with greater efficiency improvement. Our LTE CAT-1 modules have been a solution for all the Telecom operators globally and this we are sure would benefit Indian operators as well.”

Mr. Ashish Gulati, Country Head India added, “Telit solutions are well tailored to suit India market offering highest standards of performance at the most competitive cost that makes it a unique combination in the field of IoT technology globally. As Indian operators deploy LTE networks, our LTE CAT-1 modules would equip Indian telecom providers not only in embracing the IoT revolution faster but also in a cost effective manner”

Telit IoT Portal-ready modules powered by deviceWISE, make device onboarding simple to program, maintain and scale. All of Telit’s LE910 CAT-1 modules are Telit IoT Portal ready, supporting high-level commands specifically designed to provide quick and hassle-free onboarding of device and data to the cloud, customer apps, back-end systems and servers.

Telit Introduces World’s First Hybrid IoT Modules Combining 3G Cellular, Wi-Fi, Bluetooth and GNSS into a Single Package

IoT Cloud-ready, smart modules feature exclusive Intel® Atom™ x3 SoC Processor technology

Telit, a global enabler of the Internet of Things (IoT), today announced global commercial availability of the world’s first hybrid IoT modules that combine 3G Cellular, Wi-Fi, Bluetooth and GNSS into a single package. The new HE922-3GR and WE922-3GR smart module series in the xE922 family are also the first to use the Intel® Atom™ x3 SoC Processor technology with a self-contained quad-core processing engine and comprehensive I/O resources. Combined with the company IoT Portal and IoT Connectivity services, these modules deliver a complete end-to-end solution ideal for providers in a broad range of application areas including healthcare, vending, POS, public parking, smart buildings, smart grid and the industrial internet of things.

“The xE922-3GR products are game changers. When you look at how complexity of designing devices with multiple chipsets is impacting cost and time-to market, you can appreciate the power of these all-in-one hybrid modules,” said Ronen Ben-Hamou, Telit Executive Vice President of Products and Solutions. “It would take a good engineering team months to develop an IoT device prototype using disparate chips, whereas an engineer or two can now create a complete end-to-end IoT solution in just couple of weeks.”

“Across all industries and segments, businesses are always looking for shortcuts in traditional product development to get to market faster.” said Fred Yentz, Chief Executive Officer, Telit IoT Platforms. “With the combination of Telit’s Cloud-ready IoT modules, custom data plans, comprehensive IoT Portal, and unmatched IoT Know-How, we make it easy to connect, manage and integrate your ‘things’ with web-based or mobile apps or enterprise systems – providing the fastest path to business transformation, improved operational efficiencies and innovation in the market.”

Technical Specifications:
With a 34x40mm LGA footprint, the WE922-3GR and HE922-3GR deliver unparalleled features for their size. Both modules include 2.4GHz Wi-Fi 802.11 b/g/n and Bluetooth 4.0 LE. The embedded global positioning receiver in the modules is compatible with GPS and GNSS constellations. Both of them integrate the functionality of an entire processor board inside the 441-pin package based on the 1.2GHz, 64-bit, quad-core Intel® Atom™ x3 processor series and include 8GB memory, sensor inputs, battery charger logic, analog speaker and microphone audio connections, interface for primary and secondary cameras and direct support for high-resolution display with touch screen and/or keyboard. The application development environment is based on Android and Yocto Linux enabling access and reuse of vast libraries of functions and applications across all industries and segments. In addition to all of the above features, the HE922-3GR includes quad-band HSPA+ cellular connectivity delivering 21Mbps download data rate with fallback to 2G. The 3GPP Release 7 compliant HE922-3GR module supports 850/900/1900/2100MHz 3G HSPA+ bands with 850/900/1800/1900MHz 2G. The upload data rate is 5.76Mbps.

Both the WE922-3GR and HE922-3GR modules are available in two environmental grade variants. The commercial grade has an operating temperature range of 0°C to +70°C; the extended grade has an operating temperature range of -40°C to +85°C. The modules can be connected to an SD card and provide connections for a USB 2.0 port with OTG, two UART and SPI ports and I2C support.

A developers’ kit is also available for the modules which includes a high-resolution touch screen with embedded cameras and audio, all the necessary antennas and a power supply. A comprehensive set of application development tools is available online.

Telit and Intel Collaborate on Joint-Architecture for Intel IoT Platforms for the Industrial Internet of Things

Newly-published product brief illustrates a faster, simpler way to turn edge data into a business asset

Telit, a global enabler of the Internet of Things (IoT), announced it has collaborated with Intel® on a joint-architecture for multiple Intel IoT developer platforms for the Industrial Internet of Things. The commercially available Intel IoT platform consists of end-to-end reference architectures and products with Telit deviceWISE edge-intelligence technology, which includes extensive device driver libraries and built-in Cloud-readiness – giving companies an instant onramp to the Industrial IoT.

The collaboration between Telit and Intel provides far-reaching benefits for remote machine monitoring and control, production diagnostics and predictive maintenance across all markets and industries worldwide. Businesses deploying Intel IoT Platform Technology solutions can quickly establish and future-proof their IoT strategy, connect legacy and new systems, help data flow securely between edge devices and the cloud, and save money for years to come. With support for multiple operating systems and processor performance levels, solutions based on Intel IoT Gateway Technology with deviceWISE are scalable and able to meet needs for a broad range of applications.

“Earlier this year, Telit announced the formation of its Industrial IoT business unit and our collaboration with Intel has created a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO, Telit IoT Platforms. “Intel has adopted the widely-deployed deviceWISE platform architecture for its superior edge intelligence, cloud-ready connectivity and seamless integration into enterprise systems.”

“The ecosystem is critical to the Intel IoT strategy,” said Doug Davis, senior vice president of Internet of Things Group at Intel. “Collaborations with companies like Telit enable Intel to provide key IoT building blocks for our customers to easily scale and drive growth for their IoT solutions.”

Intel and Telit jointly published a product brief “A Faster, Simpler Way to Turn Edge Data into a Business Asset,” illustrating how deviceWISE can turn any Intel IoT development platform into an onramp for the industrial Internet of Things by leveraging these powerful advantages:

  1. Performance at the Edge that enables near real-time analytics, local decision-making, and tighter process controls.

  2. Advanced Data Security and Protection from Costly Attacks

  3. Scalability for varying levels of gateway performance requirements.

  4. Manageability for secure remote upgrades and services.

  5. Faster, More Flexible Deployment with a platform that supports your choice of operating systems and ecosystem applications, enabling faster time to market.

Intel is a featured partner of our deviceWISE Ready program. Our comprehensive certification process assures customers that the Intel IoT Platform has been engineered and tested for simple, quick, and reliable integration with the deviceWISE IoT Platform and is fully supported and endorsed by Telit. View the step-by-step guide to employing the Telit deviceWISE Application Enablement Platform on Intel IoT Architecture.

Telit and Intel Collaborate on Joint-Architecture for Intel IoT Platforms for the Industrial Internet of Things

Newly-published product brief illustrates a faster, simpler way to turn edge data into a business asset

Telit, a global enabler of the Internet of Things (IoT), announced it has collaborated with Intel® on a joint-architecture for multiple Intel IoT developer platforms for the Industrial Internet of Things. The commercially available Intel IoT platform consists of end-to-end reference architectures and products with Telit deviceWISE edge-intelligence technology, which includes extensive device driver libraries and built-in Cloud-readiness – giving companies an instant onramp to the Industrial IoT.

The collaboration between Telit and Intel provides far-reaching benefits for remote machine monitoring and control, production diagnostics and predictive maintenance across all markets and industries worldwide. Businesses deploying Intel IoT Platform Technology solutions can quickly establish and future-proof their IoT strategy, connect legacy and new systems, help data flow securely between edge devices and the cloud, and save money for years to come. With support for multiple operating systems and processor performance levels, solutions based on Intel IoT Gateway Technology with deviceWISE are scalable and able to meet needs for a broad range of applications.

“Earlier this year, Telit announced the formation of its Industrial IoT business unit and our collaboration with Intel has created a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO, Telit IoT Platforms. “Intel has adopted the widely-deployed deviceWISE platform architecture for its superior edge intelligence, cloud-ready connectivity and seamless integration into enterprise systems.”

“The ecosystem is critical to the Intel IoT strategy,” said Doug Davis, senior vice president of Internet of Things Group at Intel. “Collaborations with companies like Telit enable Intel to provide key IoT building blocks for our customers to easily scale and drive growth for their IoT solutions.”

Intel and Telit jointly published a product brief “A Faster, Simpler Way to Turn Edge Data into a Business Asset,” illustrating how deviceWISE can turn any Intel IoT development platform into an onramp for the industrial Internet of Things by leveraging these powerful advantages:

  1. Performance at the Edge that enables near real-time analytics, local decision-making, and tighter process controls.
  2. Advanced Data Security and Protection from Costly Attacks
  3. Scalability for varying levels of gateway performance requirements.
  4. Manageability for secure remote upgrades and services.
  5. Faster, More Flexible Deployment with a platform that supports your choice of operating systems and ecosystem applications, enabling faster time to market.

Intel is a featured partner of our deviceWISE Ready program. Our comprehensive certification process assures customers that the Intel IoT Platform has been engineered and tested for simple, quick, and reliable integration with the deviceWISE IoT Platform and is fully supported and endorsed by Telit. View the step-by-step guide to employing the Telit deviceWISE Application Enablement Platform on Intel IoT Architecture.

Telit Announces Cloud-Based Event Video Recording via OzVision Management Platform

Powerful new capability adds real-time videoto Telit’s deviceWISE platform for a complete IoT solution from connected devices such as cameras and sensors

Telit, a global enabler of the Internet of Things (IoT), today announced cloud-based event video recording via the OzVision Management Platform. This powerful new capability adds real-time video to Telit’s deviceWISE platform for a complete IoT solution from connected devices such as cameras and sensors.The OzVision system records, analyzes and distributes massive amounts of real-time data, every day, from over a million cameras worldwide.

“There are times when real-time video is critical in creating true understanding of what is happening in remote and mobile locations”, said Alon Segal, Telit CTO. “Video, integrated in an IoT solution has the unprecedented power to inform, provide convincing evidenceand provide peace of mind.”

For the automotive market, dashboard cameras will now be able to automatically capture and transmit video uponan event trigger. An alert, along with up to 30 seconds of video can be sent to company managers or family members. Fleet managers and direct supervisors can activate preset triggers when harsh braking, excessive speeding or when sensing unauthorized and after-business-hours vehicle use– and then watch a live video stream.

Security applications include fixed surveillance cameras with motion detection capability. Each time the system senses movement, it will send a video clip that starts a few seconds before motion is spotted — and continue transmitting as long it perceives an interloper. The OzVision server is also capable of integrating with third-party analytics services via its OZ INTEGRATE module.At any time, users can view a live video feed.

“The OzVision video cloud platform performs with 99.99% uptime and is a proven provider of plug and play, live view, continuous and event recording, playback and notification services, said Duby Hodd, OzVision CEO. “We offer complete integration with the deviceWISE platform with a sophisticated set of API’s to ensure rapid IoT deployment.”

Telit collaborates with an ever-expanding network of recognized experts and innovators from the M2M/IoT community around the world. Telit’s Business Partners include leading technology and product developers, system integrators and telecom carriers – offering customers hardware and software, integration services and support, wireless network services, custom point solutions and applications, or turnkey commercial deployments, as needed. The thriving deviceWISE community centers on the deviceWISE Ready program. deviceWISE Ready promotes interoperability between products and services from our Business Partners and the deviceWISE AEP, thus reducing the risk, time-to-market, complexity and cost of deploying complete end-to-end IoT solutions.

See a live demonstration of the OzVision system integrated with Telit’s deviceWISE platform atthe CTIA Super Mobility Conference in Las Vegas at the Telit exhibit booth #4832.One day prior to CTIA at Telit’s IoT Innovation expoat Caesars Palace,the OzVision demo remote controlled car will be test drivenby Telit IoT Platforms CEO, Fred Yentz.

Telit Announces Rapid IoT Development Kit with Built-in Cellular Connectivity and Cloud-based IoT Portal Integration

Full-featured kit for standalone prototyping or as cellular plug-in for popular Maker platforms

Telit, a global enabler of the Internet of Things (IoT), today announced a Rapid IoT Development Kit with built-in cellular connectivity and seamless integration with the Cloud-based Telit IoT Portal – reducing IoT solution prototyping from weeks or months to mere hours. The comprehensive kit can be used to develop standalone IoT prototypes or as a convenient cellular, Cloud-ready plug-in for popular open Maker platforms. The intuitive IoT Portal lets users connect and manage the kit, and makes it easy to securely extract and consume data by using built-in dashboards, designing web-based and mobile apps, and integrating with enterprise systems for big data analytics.

“Telit and the Texas Instruments (TI) LaunchPad™ development kits are a powerful combination for any developer looking to prototype a robust and complete IoT solution,” said Adrian Fernandez, Microcontroller Development Experience Manager, TI. “Developers can simply snap a TI LaunchPad development board onto the Telit Rapid IoT Development Kit for virtually instant cellular connectivity and integration with a cloud-based IoT platform to collect, manage and analyze your data.”

The Rapid IoT Development Kit operates in both standalone mode and interface mode. As a standalone device, it operates solely with the unique on-board processing power of the Telit xe910 module based upon the AppZone C development and runtime environment. There is a variety of sensors already on the board including accelerometer, temperature and LED indicators. In interface mode, the on-board headers enable quick plug and play stacked integration with the most popular open Maker platforms such as Raspberry Pi, TI LaunchPad, and Arduino – all free of connecting cables.

“Our new Rapid IoT Development Kit redefines IoT prototyping, allowing development engineers, system integrators and the Maker community to conceive end-to-end solutions – from sensor to app, using a complete, pre-integrated set of hardware, cellular connectivity and Cloud-services,” said John Keever, CTO Telit IoT Platforms. “All of the necessary resources and tools are there and our goal is to have users connected and active within minutes.”

See live demonstrations of the Rapid IoT Development Kit at the CTIA Super Mobility Conference in Las Vegas at the Telit exhibit booth #4832.

Telit Unwraps New 150Mbps LTE Cat 4 Automotive Smart Module

Three module variants for American, European, and Chinese car markets to be unveiled at CTIA 2016

Telit, a global enabler of the Internet of Things (IoT), today announced the addition of the LE920A4 LTE Cat 4 smart module to its portfolio of automotive-grade cellular IoT modules. The 150Mbps product addresses automakers’ growing demand for high-speed mobile data connectivity to support applications like advanced diagnostics and infotainment, remote software updates; and is fully compliant to eCall and ERA GLONASS requirements for emerging, mandated European and Russian emergency call systems. The new module is available in variants compliant with regional regulatory and mobile carrier requirements for cars to be delivered to North American, European and Chinese markets. The LE920A4 is sampling now, shipping later this year and concluding final carrier certifications Q1-2017. The new module will be used in upcoming model year cars to comply with eCall and to leverage planned conclusion of 3GPP Release 10 service rollout by major carriers in these markets.

With built-in application processor, storage and memory, the LE920A4 is an automotive smart module capable of running customer application programs completely within the module itself. Application programs running in the module have full access and control of the module’s extensive hardware resources, which include advanced multi-standard satellite navigation, analog to digital converters, audio interfaces, serial and USB 2.0 ports and other general purpose direct and multiplexed I/O.

“The LE920A4 provides our automotive OEM and tier-one customers a single hardware platform to deliver high-speed mobile data and voice connection for car models deployed in major world markets requiring broad operator certifications,” said Yossi Moscovitz, CEO of Telit Automotive Solutions. “The module’s ability to run complex applications without an external processor makes it an ideal solution for the car maker to optimize cost and simplify manufacturing. Applications closely related to the data connection like hack-detection and prevention, dead-reckoning navigation, and software revision control and re-flashing for the ECU and other onboard electronic control units can all be developed or ported to run in the module.”

Telit automotive IoT modules include the deviceWISE agent, offering seamless and instant access to the Telit IoT Portal for simple, secure and scalable automotive device onboarding. Developers can create end-to-end solutions by using simple commands that provide quick and hassle-free onboarding of device and data to the cloud, customer apps, back-end systems and servers.

The LE920A4 will be featured on the Telit booth #4832 at CTIA Super Mobility 2016, taking place at the Sands Expo, Las Vegas, September 7 through 9.

LE920A4 Technical Specifications
The module’s internal application processor is a 1.2GHz Cortex A7 CPU rated at 2,300 Dhrystone MIPS running embedded Linux Operating System. The Telit AppZone Application Development Environment (ADE), available for use with the LE920A4, helps automotive OEMs and tier-one suppliers develop and/or port application software to the module quickly and easily, enabling reuse of their own libraries along with the extensive resources available for development in the Linux environment.

The LE920A4 delivers LTE data rates of 150Mbps downlink and 50Mbps uplink with fallback support to HSPA+ at 42Mbps down and 5.76Mbps up. Additional fallback to UMTS, EDGE or GPRS gives the module the widest possible combination of connection technologies to ensure the customer application will stay connected, particularly in life-critical situations. The LE920A4 supports the latest approved eCall and ERA GLONASS standards for protocols and in-band modem. Each of the product variants supports voice over LTE (VoLTE) with circuit-switch fallback (CSFB) to 3G or 2G aligned with regional requirements. The module’s audio interface can include an internal codec for direct analog connection and eSIM support is available, tailored to individual requirements of the OEM or tier one integrator. An efficient firmware over the air (FOTA) solution framework allows the automaker to implement revision control and update of all module software. Optional hardware features include dead-reckoning location support, serial gigabit media independent interface (SGMII) for Ethernet connectivity to other data appliances in the car; and an interface to connect the module directly to an external advanced Wi-Fi integrated circuit.

The LE920A4 is a member of the Telit xE920 automotive IoT module family. Its 34 x 40 mm LGA form factor is delivered in a ruggedized, mechanically robust package with excellent thermal characteristics for effective heat dissipation. With an operating temperature range of -40°C to +85°C, it is suitable for demanding applications and environments in a cost effective, high-reliability mounting solution. xE920 modules are designed and manufactured according to ISO TS16949 processes to ensure quality and compliance with automotive OEM and tier-one supply chains requiring this certification.

Telit and Tech Mahindra Collaborate on Enabling End-To-End IoT Solutions

Multi-faceted relationship spans turnkey solutions, system integration, global business development, and engineering services

Telit, a global enabler of the Internet of Things (IoT), today announced its multi-faceted collaboration with Tech Mahindra on developing complete solutions for the Internet of Things (IoT). The relationship is centered on combining and integrating Telit’s leading portfolio of IoT products and services with Tech Mahindra’s unmatched system integration expertise and strengths in developing end-to-end enterprise solutions. Both companies are also jointly pursuing new business opportunities across many markets and industries, such as IoT horizontal and Industrial IoT around the world. Additionally, Telit has reached an agreement to outsource related engineering development and testing activities to Tech Mahindra.

As a fast-growing number of companies is exploring how the IoT can help them improve operational efficiencies and drive new business models, many – especially large multinational enterprises – remain intimidated by having to put all the pieces together by themselves. Telit and Tech Mahindra are jointly addressing these concerns by offering clients complete end-to-end solutions such as IoT solution consulting, solution development and operations that reduce the complexity, risk, cost and time-to-market versus trying to develop a custom project in house. Under its vast system integration and IT consultancy services, Tech Mahindra’s IoT experts have been fully trained and certified in designing end-to-end solutions around Telit IoT modules, connectivity and Cloud-based platforms.

“Tech Mahindra and Telit are each strategically focused on capitalizing on the exponential growth across many IoT verticals and together we are positioned to grow at a pace greater than or equal to the industry, “ said Karthikeyan Natarajan, senior vice president & global head of engineering services at Tech Mahindra. “This collaboration will address the broad IoT solutions with particular emphasis on the industrial internet and Industry 4.0 programs of our manufacturing customers across Automotive, Aerospace, Medical, discrete and hi-tech manufacturing verticals,“

“Telit is very excited about this collaboration with Tech Mahindra, resulting in far-reaching technical and business synergies that offer a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO of Telit IoT Platforms. “Together we can help organizations transform their business with end-to-end IoT solutions – from ideation generation, to system architecture, proof of concept development and full commercial deployments that are integrated with their existing enterprise systems.”

Telit and Tech Mahindra each have deep expertise working with companies large and small that rely on mission-critical performance, security and scalability. Today, both companies are already engaged in several industrial customer projects together, including a leading global heavy equipment company. Their joint capabilities can be easily applied to any company seeking to transform its business model with IoT enabled real-time remote machine monitoring and control, production diagnostics, predictive maintenance, or asset tracking solutions.