Telit Unveils Industry’s First 450 Mbps LTE-Advanced Automotive-Grade Module

LE940A9 LTE Cat 9 nested form factor family of secure, automotive-grade smart modules deliver wired broadband-like speed to power next generation connected car platforms

New Delhi, June 7, 2017 – Telit, a global enabler of the Internet of Things (IoT), today introduced the LE940A9 smart module, the industry’s first automotive-grade module to support LTE Advanced Category 9 (Cat 9) networks. The series offers three multi-band, multi-mode variants, including Voice-over-LTE (VoLTE), and is optimized for automobile manufacturers to deploy next generation connected car technology in top world markets.

The LE940A9, the latest addition Telit’s popular xE940 family of automotive-grade modules, delivers 450 Mbps download and 50 Mbps upload speeds with extremely low latency and advanced security, enabling the next wave of automobile industry’s applications and services which also serve as a springboard for autonomous driving.

Digital transformation is driving the evolution of the connected car with major improvements in driver safety, new revenue streams, and an immersive connected experience. With government safety mandates around the globe, added advancements in the connected world, there is greater demand for more value-add services and feature-rich in-vehicle applications. From commercial and consumer telematics services, to autonomous driving and driver assistance features, along with a host of other applications dependent on remote software updates, including infotainment; secure, wired broadband-like speed is now a requirement. The evolution to high-speed wireless connectivity is only possible if powered by LTE Advanced, with little to no lag time, for the applications to work.

“In addition to serving as a significant advancement for the connected car industry, the LE940A9 series is a powerful testament to Telit’s continued technology leadership enabling the future of the connected car worldwide,” said Yossi Moscovitz, CEO of Telit Automotive Solutions. “Not only does the LE940A9 enable unprecedented applications with the speed and low latency of Cat 9 of the multi-mode variants but also simplifies integration and reduces costs that help accelerate the development of our OEM partners’ global roadmaps.”

The LE940A9 powers the entire connected car platform, supporting current needs while including advanced features that enable future integration of up-coming value-added, telematics and managed services. The module can run in-vehicle applications inside a secure processing environment from the built-in application processor, storage and memory. Automotive application programs can run entirely and securely on the module itself protected by advanced cyber-security capabilities.

LE940A9 Features
Worldwide GNSS support: GPS, GLONASS, Galileo, Beidou, and QZSS support.

Advanced security addresses industry demands: Features include secure boot, secure storage and more.

Future-proof technology with multi-radio access technology for exceptional coverage: 3GPP Release 11, LTE-Advanced with Carrier Aggregation (3xCA) support, and 3G/2G fallback delivers widest possible combination of connection technologies with always-on communications, particularly in life-critical situations.

Safety-first: Supports eCall, ERA GLONASS, other regulatory and safety standards, and is VoLTE-ready (voice over LTE) with circuit-switch fallback (CSFB) to 3G or 2G aligned with regional requirements.

Design-once-use-anywhere: The LE940A9 40×40 mm LGA form factor nests with the 34x40mm Telit xE920 automotive module family, offering the OEM or tier-one integrator, superior flexibility to address economic, feature and regional requirements with a single device design.

Automotive-grade: Ruggedized, mechanically robust package with excellent thermal characteristics for effective heat dissipation. With an operating temperature range of -40°C to +85°C, it is suitable for demanding applications and environments. Telit designs and manufactures automotive modules per ISO TS16949 processes to ensure quality and compliance with automotive OEM and tier-one supply chains requiring the certification.

Telit Introduces Ultra-slim, Smart Antenna GNSS Location Module

A module simplifies the development process and delivers superior performance for wearables, personal trackers, and other battery-dependent applications

New Delhi, May 19, 2017 – Telit, a global enabler of the Internet of Things (IoT), today announced the introduction of a new, ultra-slim family of smart antenna GNSS (Global Navigation Satellite System) receiver modules. These fully integrated modules include a comprehensive feature set that eliminates the need for additional components, ideal for IoT projects with size, cost, and time constraints.

Easing the burden for developers with little or no RF design experience, the SL876Q5-A is compliant with regulatory and industry standards specifications. The module combines an omni-directional low profile embedded antenna and an internal RF switch. This combination is well suited for applications needing two antennas, such as personal trackers and alarms, which must be equipped with a main and a backup antenna when the signal becomes compromised. A true turnkey solution, the SL876Q5-A includes best-in-class features such as an additional Low Noise Amplifier (LNA), Surface Acoustic Wave (SAW) filter, and efficient power management technology in an ultra-slim Leadless Chip Carrier (LCC) package. The inclusion of several low power modes reduces total power consumption while maintaining position accuracy, which extends battery life—a critical requirement for wearables, personal trackers, and other battery-dependent applications.

“The SL876Q5-A delivers on everything our customers and partners have come to expect from the industry’s leading IoT solutions provider,” said Ronen Ben-Hamou, Telit’s EVP of Products and Solutions. “IoT developers continuously search for solutions that simplify the design process. We’ve developed a compact solution with features that deliver industry-leading performance without compromising performance. Not only does the SL876Q5-A eliminate the need for additional components in most use cases, but also cuts development time and costs considerably.”

SL876Q5-A Features
Full GNSS for exceptional coverage
· Quad-GNSS: GPS/ QZSS and GLONASS or BeiDou and it is Galileo ready
· A-GNSS: Onboard generation and server-generated file injection that can be stored into the embedded flash memory

Superior performance
· Omni-directional antenna design delivers industry-leading performance in sensitivity, tracking performance, and accuracy
· MEMS wakeup feature offers lowest power consumption
· Built in LNA for improved sensitivity

Simplify integration
· Primary UART port. A secondary port can be configured as UART, I2C, or SPI at boot/reset
o If I2C, the secondary port supports either commands and messages or MEMS wakeup.
· Embedded RF switch allows easy integration with external antennas

Industry-leading features
· Ultra-slim design
· 11 x 11.9 x 2.3 mm LCC package for space constrained devices
· Flash memory enables firmware upgrades, customization, and AGPS file storage, which is ideal for battery-dependent devices
Availability begins in the second quarter of 2017. Learn more about the new SL876Q5-A slim antenna module.

Telit Unveils New IoT University

Training facility includes innovation and design lab to help companies accelerate business innovation based on IoT enabled solutions

Telit, a global enabler of the Internet of Things (IoT), today announced the official launch of Telit IoT University. Designed for IoT developers and integrators, Telit IoT University, part of the company’s IoT Know How suite of consultative services, teaches customers and partners how to succeed in launching IoT solutions that deliver measurable business outcomes.

Located at Telit IoT Platforms division in Boca Raton, Florida, Telit IoT University features a broad curriculum, including courses and hands-on labs co-developed by Telit and Florida Atlantic University’s Institute for Sensing and Embedded Network Systems Engineering (I-SENSE). The University, an expansion of the company’s original deviceWISE University program, includes an innovation and design lab that showcases Telit deviceWISE Ready partner applications and gives students experience with a variety of hardware components required for a successful IoT deployment.

“Telit IoT University helps companies accelerate their IoT projects from idea to completion by providing the necessary tools and easy access to Telit’s IoT ecosystem and developer resources,” said Fred Yentz, CEO of Telit IoT Platforms. “Leading companies immediately apply what they learn at Telit IoT University to launch innovative products and services and improve operational efficiencies to capitalize on the full potential of today’s digital transformation.”

Courses, which are taught monthly, provide hands-on experience to help students start prototyping an IoT solution. Customers may also request on-site training at their location.

Telit IoT University courses include:

· IoT for Developers: Teaches students how to connect “things” to “apps” by exploring multiple transportation types and methods while learning how to use the management portal.
· IoT for Integrators: Introduces and reinforces the critical tasks involved with designing, launching, integrating and maintaining an enterprise IoT solution.
· IoT Immersion: A combination of IoT for Developers and IoT for Integrators, this course teaches students how to integrate devices with back-end applications and includes a comprehensive final project aimed at solving a real-world scenario.
· Industrial IoT for Integrators: Designed for manufacturers, this course teaches attendees how to acquire, send and transfer bi-directional information between PLCs and ERP applications.
· IoT Sales & Marketing Essentials: Provides a high-level overview of IoT concepts, use cases and IoT solutions.
· IoT Operations & Administration Gives the technician or engineer tasked with the administration of an IoT solution the skills to maintain the system.

To learn more or register for a course, visit TelitIoTUniversity.com.

Telit Adds LoRaWAN™ / BLE Combo Module to its Broad Range of IoT Wireless Technologies

Company also joins the LoRa Alliance™

Telit, a global enabler of the Internet of Things (IoT), today announced the introduction of the RE866A1-EU, its LoRaWAN™ protocol, Bluetooth low energy (BLE) IoT combo module. With the addition of LoRaWAN technology, BLE and Wi-Fi to NB-IoT, Cat M and to other cellular standards, the company continues to offer the industry’s broadest portfolio of wireless modules that feature a common form factor. Telit’s pin-compatible modules enable integrators to design devices that can be deployed with different variants, leveraging the technology that is best suited to each individual deployment area or use case, both in business and technical terms.

The company has also has joined the LoRa Alliance™, which is an open, non-profit association of over 450 members in the IoT ecosystem. It was initiated by industry leaders with the mission to standardize low power wide area networks (LPWANs) being deployed around the world to enable IoT, machine-to-machine (M2M), smart city and industrial applications. As an alliance member, Telit will collaborate to enhance the LoRaWAN protocol, by sharing knowledge and experience to guarantee interoperability among operators in one open, global standard.

“We are very pleased to have Telit in the Alliance. As one of the leading solution enablers and longest standing players in the IoT space, Telit brings experience and technology that can help meet the needs of the rapidly growing LPWAN market,” said LoRa Alliance Chairman, Geoff Mulligan.

The new module is fully compliant with the latest LoRaWAN standard. It is an ideal solution for public or private networks, smart metering, remote sensing, industrial automation/monitoring and control, wireless alarm and security systems, agriculture, asset tracking, street lighting and smart city applications.

“Enabling IoT solutions from end to end is part of the Telit brand promise. That includes maintaining a strong portfolio of low power modules that is fully aligned with market trends and free of gaps in relevant technologies,” said Ronen Ben-Hamou, Telit’s EVP of Products and Solutions. “With the new RE866, a customer can re-use a device and application designed for cellular to create new business opportunities by simply dropping our LoRaWAN protocol module in it, potentially creating a new product, serving a previously unaddressed market or developing a new business model. And the same goes, of course, for our Wi-Fi, and the emerging new LTE Cat NB and Cat M modules.”

Product Detail
The RE866 combo module supports both the unlicensed LPWAN LoRaWAN standard and Bluetooth® Low Energy with NFC capabilities inside the 863-931 MHz band. It offers a long range LoRaWAN radio link as well as different BLE peripheral and central roles. With full over-the-air capabilities, the module can stay current with standards evolution through remote firmware installation and upgrading. It is a natural gateway between BLE sensor devices connected to the module, sending data to a LoRaWAN protocol network. The RE866 is pin compatible with the NE866 (LTE Cat NB) module allowing customers to move from licensed to an unlicensed standard quickly and at little or no cost. It is available in May 2017. Learn more about the new RE866A1-EU module at http://www.telit.com/sr-rf/re866/.

Telit Hires Former SAP IoT Executive as new CMO

Telit, a global enabler of the Internet of Things (IoT), today announced that Shawn Reynolds has joined the company as Chief Marketing Officer. Mr. Reynolds comes to Telit from SAP, the world’s leader in application and analytics software and leading enterprise Cloud company, where he was global vice-president and head of IoT marketing.

As a core member of the Telit executive team, Mr. Reynolds will be responsible for directing global marketing strategy, managing brand awareness and reputation and developing global programs that drive the success of the company’s products and services in the fast-growing IoT market.

Prior to joining Telit, Reynolds led SAP IoT marketing and was instrumental in the development of the SAP IoT go-to-market strategy and the creation of the SAP Leonardo brand. He held multiple leadership positions over the last ten years responsible for marketing new and emerging technologies. He also led cloud and services marketing teams, playing an important role in defining new messaging and positioning for SAP solutions

“Shawn’s extensive marketing leadership, IoT industry insights and executive-level experience at SAP make him uniquely qualified to help guide Telit to become the global leader in enabling end-to-end IoT solutions” said Telit CEO, Oozi Cats. “We are privileged that Shawn is coming to us from SAP with whom Telit has been collaborating for a number of years on driving IoT-centered business transformation”

“I am very excited and honored to join the Telit leadership team and drive their global marketing efforts. I was drawn to Telit for its success as a pure-play IoT company, its vision and innovative spirit,” commented Shawn Reynolds. “Telit is positioned well to disrupt the market, and together with our customers, we will reshape the way the world lives, works and plays.”

The company also announced that current CMO, Jack Indekeu, is stepping down to pursue personal interests, but will remain with the company in a reduced capacity to help facilitate a seamless transition and oversee strategic marketing projects. Mr. Indekeu is a wireless industry veteran who joined Telit four years ago. He has been at the forefront of evolving Telit from a leading IoT module provider to developing our fast-growing services business and becoming an enabler end-to-end IoT solutions for enterprise customers around the world.

“We thank Jack for his many contributions to the organization and we are grateful that he’s staying with us in a senior advisory role,” concluded Mr. Cats. “Jack clearly left a positive mark on Telit and has created a strong marketing organization and a solid foundation for Shawn to build on.”

Telit Boosts Presence in India with Major R&D Center in Bangalore

Telit, a global enabler of the Internet of Things (IoT), is expanding its presence in India with a substantial R&D center in Bangalore. With the recent acquisition of Silicon Valley-based GainSpan Corporation, a wireless connectivity solution provider specializing in design and development of ultra-low power Wi-Fi technology, Telit gained about 60 software development, application and support engineers in one of India’s top high-tech regions.

The new Telit R&D center will continue working on Wi-Fi technologies for battery-powered devices along with related intellectual property (IP) in embedded software, including network stacks and application reference designs. Efforts from the Bangalore team have resulted in state-of-the-art developments in Wi-Fi and advanced security protocols, reflected in key patents that have influenced Wi-Fi industry standards. Wi-Fi is a desirable technology for IoT applications and the arrival of ultra-low-power options opens the door to a vast market of battery-powered application areas that have been protracted to date.

ABI Research forecasts the global wireless connectivity market, excluding cellular, to reach more than 10 billion annual integrated circuit shipments by 2021, with 47% of devices enabled by Wi-Fi. Wi-Fi will see its most significant growth in IoT verticals, such as wearables, automotive, the smart home, and other nascent IoT verticals that demand low power. With the new Bangalore R&D center, Telit bolsters its foothold in India and augments talent and capabilities critical to maintaining its innovation leadership edge. The strategic move will enable Telit customers to benefit from an extensive end-to-end IoT solutions portfolio, now addressing the growing market of battery-powered devices that rely on Wi-Fi and other low-power technologies.

“With the new Bangalore R&D center, we look forward to working closely with our solution partners to help our customers leverage the power of an IoT solutions portfolio that now addresses the full gamut of technologies for the growing market of battery-powered devices, including Wi-Fi, BLE and other low-power technologies,” said Ashish Gulati, Country Head, Telit India. “Access to the existing GainSpan talent at the Bangalore facility brings Telit into a leadership position in technology development capabilities. The resulting combined R&D strength helps us to deliver even more comprehensive solutions to our target segments and customers.”

The recent acquisition of GainSpan strengthens the company’s “sensor-to-cloud” solution proposition and positions Telit to better exploit new short range opportunities leveraging existing products including cellular, BT/BLE, GNSS modules; IoT connectivity and platform services. The integration of the unique variety of low-power Wi-Fi technology from GainSpan, with low standby current and fast wake-up time into the Telit portfolio enables customers to extend the battery life of their devices for years. Additionally, customer devices can be designed with a simple and inexpensive MCU or without one at all, enabling increased sales to existing customers and the capture of customers in new segments.

Telit Unveils Bluetooth 5 Module at Mobile World Congress 2017

Telit, a global enabler of the Internet of Things (IoT), today introduced the Bluetooth Low Energy (BLE) BlueMod+S50 single mode module. This marks the industry’s first introduction of a standalone and certified, Bluetooth® 5 compliant module with a compelling mix of future-proof features designed to extend product lifecycles. Building on the success of the Telit BlueMod family of Bluetooth modules and complete integrated set of IoT Products and services, the BlueMod+S50 is key to bringing low power, “connectionless” IoT designs and services to market quickly.

The new BlueMod+S50 module from Telit marks an industry milestone. Now, developers can adopt this cutting-edge technology into use cases not possible with previous generations of Bluetooth, such as full in-building connections. The latest Bluetooth 5 specification offers significant updates with quadruple range and speeds that are twice as fast, while increasing the capacity of connectionless data broadcasts by 800%. Always a step ahead, Telit incorporated additional features such as secure, integrated NFC (Near Field Communication) capability and support for most GATT based Client and Server profiles.

“What makes the BlueMod+S50 so compelling is the combination of industry’s latest silicon with Telit’s state of the art engineering for an overall richer, more intelligent user experience,” said Felix Marchal, Executive Vice President of GNSS and Short Range Wireless. “We take it a step further with our ‘design once, use anywhere’ philosophy by including resources from the Telit IoT Know How program—assisting customers holistically with deployment of completion solutions from idea to market. The new module is not only swappable with previous generations of our Bluetooth line, it includes enhancements that benefit verticals which depend on advanced, forward-thinking technology like smart home and healthcare.”

Key Features and Benefits:
· Generic GATT Client and Server: Simplifies configuration
· Terminal I/O: Enables fast and reliable transport of data/ protocols transparently over Bluetooth
· NFC Handover: Eliminates manual interaction, delivering a nearly instant and most important—secure connection.
· Reliable line-of-sight range: over 800* meters. (*250m with Android phone and iPhone).
· Ultra-Low power: Proprietary UICP (UART Interface Control Protocol) further reduces power consumption of the module by 30-100 times compared to non UICP operations.

The BlueMod+S50 delivers industry-leading low power consumption and is well suited for many verticals including home automation, healthcare, telematics, asset management, routers and gateways, retail, and smart cities in addition to battery dependent devices with long product lifecycles. Designers can integrate the module without additional hardware via a robust choice of interfaces, including GPIO, ADC, UART, SPI, and others.

The new module is being fast tracked to address market demand for advanced, low-power wireless networking technology. It is the company’s latest addition to the Advanced Edge Technology portfolio that supports Bluetooth, Short range, GNSS, Wi-Fi, LoRa, and LPWA. As device makers are looking to develop IoT solutions that remain relevant for years to come, they are eager to adopt future-proof solutions. ABI Research forecasts Bluetooth-enabled device shipments over the next five years will increase by an average of half a billion per year through 2021, reaching more than five billion.

Learn more about the new BlueMod+S50 module in Telit’s booth at Mobile World Congress 2017, located at hall 5 stand E61 and also at http://info.telit.com/bluemods50.

* Samples, evaluation and development kits available in the second half of 2017.

Telit adds Wi-Fi and low-power solutions for IoT with acquisition of GainSpan to extend end-to-end IoT solutions reach

Telit, a global enabler of the Internet of Things (IoT), today announced that it has agreed to acquire Silicon Valley-based GainSpan Corporation (“GainSpan”). GainSpan is a wireless connectivity solution provider that specializes in the design and development of ultra-low power Wi-Fi technology. The company manufactures and commercializes chips and modules for battery-powered devices and related intellectual property (IP) with embedded software, including network stacks and application reference designs. GainSpan has over 90 employees, mostly R&D and application and support engineers, spread across an R&D center in Bangalore, India and San Jose, California.

“As we enter an era of maturity for the IoT, we are starting to witness the appearance of spaces within it such as the Internet of Sensors, the Internet of Cars, and the Internet of Digital,” said Oozi Cats, CEO of Telit. “With few exceptions, the ability to cut the power cord is an essential growth engine for all these branches of the IoT.”

According to the September 2016 “IoT Forecasts” from Machina Research, by 2025 about 75% of the more than 27 billion IoT connections will be short range, which is largely comprised of the various types of Wi-Fi. Wi-Fi is a leading technology for applications within the IoT that are battery-dependent, due to the low-power consumption associated with the technology.

The new business addition positions Telit to expand its complete end-to-end IoT solutions portfolio and address the growing market of battery-powered devices that rely on Wi-Fi and other low-power technologies. GainSpan products are situated at the intersection of several emerging segments in IoT such as healthcare, building management, cold-chain logistics, and a wide range of commercial and industrial application areas. GainSpan’s top-tier customer base leverage the company’s IP to deliver seamless integration of Wi-Fi with low-power technologies like BLE and 6LoWPAN for reliable, secure connectivity.

“The acquisition of GainSpan brings to Telit a world-class portfolio and a proven track record of Wi-Fi and low-power module solutions trusted by tier-one customers,” continued Oozi Cats. “Combined with our existing strength in delivering the most comprehensive, relevant portfolio of products and solutions for the IoT, this addition positions us well for future growth in our target segments, including security and surveillance, home automation, healthcare, asset management, and smart cities.”

Assets from GainSpan align well with existing Telit products including cellular, BT/BLE, GNSS modules; IoT connectivity and platform services, strengthening the company’s “sensor-to-cloud” solution proposition. The integration of the unique variety of low-power Wi-Fi technology from GainSpan, with low standby current and fast wake-up time into the Telit portfolio enables customers to extend the battery life of their devices for years*. GainSpan IP also offloads Wi-Fi services and networking functionality from the application. Customer devices can be designed with a simple and inexpensive MCU or without one at all.

Telit launches its Advanced Internet of Things (IoT) Modules for the India market

Telit Communications PLC (AIM:TCM), a global enabler of the Internet of Things (IoT), announced the launch of its advanced portfolio of LTE Cat.1 (IoT) modules in India. The CAT-1 module series serves customers requiring a mid-speed, low-power, long life-cycle mobile data solution for new or existing cellular-connected devices.

With Telit’s flagship LTE CAT-1 modules the Telecom providers in India would find it much easier to embrace the IoT revolution. These modules would help customers solve their wireless needs as they move their IoT solutions from 2G to 4G LTE networks. It helps deliver network based solutions with cost savings and longevity to bring today’s IoT products in to the future.

Mr. KyungJun Lee, Senior Director Marketing Telit APAC said, “Telit is a global leader in IoT technologies and offers the widest spectrum of IoT communication modules, IoT Connectivity and IoT Platform in the industry. The application of IoT in various fields within India has seen innumerable benefits for both the service providers and customers. These have been achieved at a minimal cost coupled with greater efficiency improvement. Our LTE CAT-1 modules have been a solution for all the Telecom operators globally and this we are sure would benefit Indian operators as well.”

Mr. Ashish Gulati, Country Head India added, “Telit solutions are well tailored to suit India market offering highest standards of performance at the most competitive cost that makes it a unique combination in the field of IoT technology globally. As Indian operators deploy LTE networks, our LTE CAT-1 modules would equip Indian telecom providers not only in embracing the IoT revolution faster but also in a cost effective manner”

Telit IoT Portal-ready modules powered by deviceWISE, make device onboarding simple to program, maintain and scale. All of Telit’s LE910 CAT-1 modules are Telit IoT Portal ready, supporting high-level commands specifically designed to provide quick and hassle-free onboarding of device and data to the cloud, customer apps, back-end systems and servers.

Telit Introduces World’s First Hybrid IoT Modules Combining 3G Cellular, Wi-Fi, Bluetooth and GNSS into a Single Package

IoT Cloud-ready, smart modules feature exclusive Intel® Atom™ x3 SoC Processor technology

Telit, a global enabler of the Internet of Things (IoT), today announced global commercial availability of the world’s first hybrid IoT modules that combine 3G Cellular, Wi-Fi, Bluetooth and GNSS into a single package. The new HE922-3GR and WE922-3GR smart module series in the xE922 family are also the first to use the Intel® Atom™ x3 SoC Processor technology with a self-contained quad-core processing engine and comprehensive I/O resources. Combined with the company IoT Portal and IoT Connectivity services, these modules deliver a complete end-to-end solution ideal for providers in a broad range of application areas including healthcare, vending, POS, public parking, smart buildings, smart grid and the industrial internet of things.

“The xE922-3GR products are game changers. When you look at how complexity of designing devices with multiple chipsets is impacting cost and time-to market, you can appreciate the power of these all-in-one hybrid modules,” said Ronen Ben-Hamou, Telit Executive Vice President of Products and Solutions. “It would take a good engineering team months to develop an IoT device prototype using disparate chips, whereas an engineer or two can now create a complete end-to-end IoT solution in just couple of weeks.”

“Across all industries and segments, businesses are always looking for shortcuts in traditional product development to get to market faster.” said Fred Yentz, Chief Executive Officer, Telit IoT Platforms. “With the combination of Telit’s Cloud-ready IoT modules, custom data plans, comprehensive IoT Portal, and unmatched IoT Know-How, we make it easy to connect, manage and integrate your ‘things’ with web-based or mobile apps or enterprise systems – providing the fastest path to business transformation, improved operational efficiencies and innovation in the market.”

Technical Specifications:
With a 34x40mm LGA footprint, the WE922-3GR and HE922-3GR deliver unparalleled features for their size. Both modules include 2.4GHz Wi-Fi 802.11 b/g/n and Bluetooth 4.0 LE. The embedded global positioning receiver in the modules is compatible with GPS and GNSS constellations. Both of them integrate the functionality of an entire processor board inside the 441-pin package based on the 1.2GHz, 64-bit, quad-core Intel® Atom™ x3 processor series and include 8GB memory, sensor inputs, battery charger logic, analog speaker and microphone audio connections, interface for primary and secondary cameras and direct support for high-resolution display with touch screen and/or keyboard. The application development environment is based on Android and Yocto Linux enabling access and reuse of vast libraries of functions and applications across all industries and segments. In addition to all of the above features, the HE922-3GR includes quad-band HSPA+ cellular connectivity delivering 21Mbps download data rate with fallback to 2G. The 3GPP Release 7 compliant HE922-3GR module supports 850/900/1900/2100MHz 3G HSPA+ bands with 850/900/1800/1900MHz 2G. The upload data rate is 5.76Mbps.

Both the WE922-3GR and HE922-3GR modules are available in two environmental grade variants. The commercial grade has an operating temperature range of 0°C to +70°C; the extended grade has an operating temperature range of -40°C to +85°C. The modules can be connected to an SD card and provide connections for a USB 2.0 port with OTG, two UART and SPI ports and I2C support.

A developers’ kit is also available for the modules which includes a high-resolution touch screen with embedded cameras and audio, all the necessary antennas and a power supply. A comprehensive set of application development tools is available online.