High-Temperature Silicon Power Switches from STMicroelectronics Enhance Reliability in Motorcycles and Industrial Applications

High-temperature Silicon-Controlled Rectifiers (SCRs) from STMicroelectronics allow manufacturers of voltage regulators, inrush current limiters for switch-mode power supplies, motor-control circuits, and industrial solid-state relays to improve the reliability of their applications and/or reduce costs by using smaller heatsinks.

Addressing a wide range of industrial and two- and three-wheel vehicle applications, ST’s high-temperature SCRs are particularly well suited to voltage regulators in markets where cost efficiency and high reliability are key requirements.

Operating with junction temperatures of up to 150oC, the TN4015H SCRs offer on-state RMS current ratings of 40A, extending and complementing the existing 12A – 20A product range. They are designed to offer tight control of the gate triggering current, leading to enhanced reproducibility on the customers’ assembly lines with corresponding improvements in the reliability of the end products. The new SCRs are also more gate-sensitive compared with previous generations, while delivering best-in-class electrical noise immunity.

Other key technical features include:
High noise immunity (dV/dt up to 1000V/μs);
600V blocking voltage;
High turn-on current rise (dI/dt = 100 A/μs);
ECOPACK®2 packaging for compliance with safety regulations and faster certification;
Available in various power packages, with UL 1557-certified[1] insulated packages withstanding up to 2500 VRMS.

The TN4015H 40A SCRs are available now in volume production in D2PAK, TO-220AB, and TO-220AB insulated packages, priced from $0.507 for 1,000 unit orders.

For more information, please go to www.st.com/tn4015h-nb

STMicroelectronics Teams with Mobile-Payment Partners to Create Turnkey, Certification-Ready Solution for Wearable Devices

· ST, Giesecke & Devrient (G&D), and FitPay join forces to overcome traditional barriers to OEMs implementing payment applications on wearable devices
· Groundbreaking secure solution with Secure Element pre-approved for use with devices to integrate tokenized payments from Mastercard or Visa
· Turnkey solution combines all necessary firmware, software, and hardware, including ST’s trusted security chip

Mobile payments may go mainstream on wearable devices like smartwatches by taking advantage of a new ready-to-use payment solution containing technology from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

ST, G&D, and FitPay have used ST’s security chip to jointly create the first secure hardware and software solution that is pre-approved for use by device manufacturers with the aim to develop integrated tokenized payments from Mastercard or Visa. This effort reduces the well-known barriers to implementing card payments on mobile devices and enables wearable-device OEMs to concentrate on product development. The joint solution gives users the flexibility to load multiple payment cards from various banks and from different payment networks onto the wearable, making contactless payments easy, independent of the end-device’s operating system.

A secure operating system (G&D), payment application management software (FitPay), and hardware components needed to support a mobile payment application are included and fully integrated around ST’s trusted ST54E security chip (embedded Secure Element, eSE) that handles cryptographic processing and tamper-proofing.

ST has leveraged the breadth of its component portfolio to satisfy all functional requirements for a payment device. Alongside the ST54E, the reference design contains the STS39230 NFC booster that supports contactless connection to the payment terminal and allows a small-size antenna, an LIS2DS12 MEMS accelerometer that enables gesture-activated payment, Bluetooth® Smart ICs, a USB battery charger, and an energy-saving microcontroller from ST’s ultra-low-power STM32L4 line.

Michael Orlando, CEO of FitPay, said: “Wearable devices are transforming the payment experience, and FitPay, ST, and G&D are making it easier to develop payment-enabled wearables. This reference design from ST demonstrates a fully integrated payment solution for manufacturers.”

G&D’s mobile-payment solutions are commercially proven and support payments at contactless-enabled merchant locations around the world. Axel Deininger, Executive Vice President and Head of G&D’s Enterprise Security/OEM division said, “The integration work we have done together with ST and FitPay to create this reference design overcomes the critical road blocks to delivering the freedom of mobile payments for consumers worldwide.”

“Our vision is to enable secure payments to a generation of new devices, giving consumers around the world new and innovative ways to pay,” said Kiki Del Valle, Senior Vice President, Commerce for Every Device at Mastercard. “Mastercard created a standard for expanding secure contactless and embedded payment options globally, and STMicroelectronics and its partners have created an intelligent and powerful solution to mobile-payment challenges – that leverages our tokenization service – to deliver secure and trusted payments-enabled devices.”

“As the market for payment-enabled wearables grows, manufacturers need easy ways to bring secure transactions and connectivity to their devices,” said Avin Arumugam, Senior Vice President, Internet of Things (IoT), Visa Inc. “The solution ST and its partners are offering is a critical step in bringing contactless Visa payments to a whole new generation of IoT devices.”

Laurent Degauque, Marketing Director, Secure Microcontroller Division, STMicroelectronics, said, “The market has been waiting for a turnkey reference design that greatly simplifies the way device OEMs interact with the payment ecosystem and this effort fits the bill. It provides everything needed for wearables to become the devices that will make mobile payments ubiquitous, simple, safe, and secure.”

The ST54E is available now. Contact ST Sales for pricing.

Miniature Multi-Sensor Module from STMicroelectronics Jumpstarts IoT and Wearable Designs

· Sensing and connectivity hub ideal for developing products such as wearables, gaming accessories, smart-home and IoT devices
· Leverages powerful open software ecosystem for faster time to market

STMicroelectronics’ 13.5mm x 13.5mm SensorTile is currently the smallest turnkey sensor board of its type, containing a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone. With the on-board low-power STM32L4 microcontroller, it can be used as a sensing and connectivity hub for developing products such as wearables, gaming accessories, and smart-home or Internet-of-Things (IoT) devices.

SensorTile has a complete Bluetooth® Low-Energy transceiver including a miniature single-chip balun on-board, as well as a broad set of system interfaces that support use as a sensor-fusion hub or as a platform for firmware development. It can be simply plugged to a host board, and when powered it immediately starts streaming inertial, audio, and environmental data to ST’s BlueMS smartphone app that can be downloaded free of charge from popular app stores.

Software development is fast and easy thanks to a vast ecosystem of Application Program Interface (API) based on the STM32Cube Hardware Abstraction Layer and middleware components, including the STM32 Open Development Environment. The system is fully compatible with the Open Software eXpansion Libraries (Open.MEMS, Open.RF, and Open.AUDIO), as well as many third-party embedded sensing and voice-processing projects. Many example programs available in source code offer a starting point for evaluation and customization, including software for position sensing, activity recognition, and low-power voice communication.

The complete kit includes a cradle board, which carries the 13.5mm x 13.5mm SensorTile core system in standalone or hub mode and can be used as a reference design. This compact yet fully loaded board contains a humidity and temperature sensor, a micro-SD card socket, as well as a lithium-polymer battery (LiPo) charger. Its simple layout demonstrates how a complete wearable prototype customized with extra functionalities can be easily designed with the SensorTile core system.

The pack also contains a LiPo rechargeable battery and a plastic case that provides a convenient housing for the cradle, SensorTile, and battery combination.

Also part of the SensorTile kit is a cradle/expansion board with an analog audio output, a micro-USB connector, and an Arduino-like interface that can be plugged into any STM32 Nucleo board to expand developers’ options for system and software development. A programming cable is also included.

The SensorTile kit (STEVAL-STLKT01V1) is available now from distributors or can be purchased directly from st.com, priced at $89.00.

Main features of SensorTile core system:

· LSM6DSM 3D accelerometer + 3D gyroscope
· LSM303AGR 3D Magnetometer + 3D accelerometer
· LPS22HB pressure sensor/barometer
· MP34DT04 digital MEMS microphone
· STM32L476 microcontroller
· BlueNRG-MS network processor with integrated 2.4GHz radio

For further information please visit www.st.com/sensortile

STMicroelectronics Boosts Trusted Computing with New Advanced Security Modules

v Expansion of STSAFE family with latest Trusted Platform Modules (TPMs) extends support for state-of-the-art hardware-based online security

v Largest on-chip memory in the market provides greater storage for sensitive data

v Devices are certified to highest security-industry standards and supported by independent Certification Authority (CA)

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and an active member of the Trusted Computing Group (TCG) for more than a decade, has introduced two state-of-the-art security modules that provide an industry-validated shield to protect computers and smart connected devices against cyber-attacks.

The new STSAFE Trusted Platform Modules (TPM) store system-authentication data such as cryptographic keys and software measurements in inaccessible and unalterable hardware, offering an industry-standardized way to protect PCs and servers, as well as other home and office equipment such as printers, copiers, home gateways, network routers, and switches. This protected storage prevents attackers from interfering with the device’s integrity, stealing private data, or taking over the system to gain unauthorized access or privileges that would put the system, data, or its network at risk.

“Robust security is central to maintaining trust in the rapidly growing number of smart connected devices that support the way we live and work,” said Marie-France Florentin, General Manager, Secure Microcontrollers Division, STMicroelectronics. “Our state-of-the-art security modules combine the latest trusted computing technology with value-added features that enable superior protection for end-users’ privacy and safety.”

The Trusted Computing Group’s latest TPM 2.0 specification adds extra features over and above the earlier TPM 1.2[1], including cryptographic algorithms and support for user hierarchies. The first of ST’s new STSAFE-TPM devices, the ST33TPHF2ESPI, supports both specifications and can switch easily between the two, allowing OEMs to provide TPM 1.2 or TPM 2.0 capability on the latest device technology. The second device is the ST33TPHF20SPI, which supports TPM 2.0 and has the largest non-volatile memory in the market to provide up to 110Kbytes storage for sensitive data.

The STSAFE-TPM modules leverage ST’s expertise with the secure ARM® SecurCore® SC300™ processor, which has anti-tamper, data-watching, and memory-protection features. Both devices are Common Criteria (CC) and Trusted Computing Group (TCG) certified against the applicable TPM 1.2 and 2.0 protection profiles and US Federal Information Processing Standard (FIPS) 140-2 certifications are in progress. The new modules come with RSA and ECC[2] Endorsement Keys[3] (EKs) needed to support authentication and associated key certificates are provided, signed by the independent certification authority Globalsign Ltd to guarantee authenticity.

The ST33HTPH2ESPI and ST33HTPH20SPI are available in either a TSSOP28 or QFN32 package. Both devices are in production now. Please contact your ST sales office for pricing options and sample requests.

STSAFE is a family of authentication products offering turn-key solutions. All STSAFE products rely on highly secure MCUs that achieve top-level Common Criteria EAL5+ certification, as certified by independent labs. The STSAFE product family is aimed at offering well-tailored solutions to meet the increasing security challenges in Trusted Computing, Brand Protection, and the IoT.

New Automotive Chips from STMicroelectronics Bring High-End Graphics, Audio, and Video to Entry and Mid-Range Vehicles

v Advanced chip integration brings full-digital head unit with features like smartphone mirroring to cost-conscious vehicle markets

v High-performing multi-processor architecture ensures high graphics, video, and audio quality

v Dedicated on-chip microcontroller with crypto acceleration ensures best-in-class security

Full-digital instrument panels that give a high-end feel to any car are coming to the mid and entry ranges, enabled by new technology from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top supplier of advanced automotive ICs.

ST’s new Accordo 5 family of automotive processors meet crucial display-performance and security demands in a low-power compact platform suitable for lower-cost vehicles.

The devices enable state-of-the-art digital instrument clusters and Audio/Video/Navigation (AVN) head units to become more affordable than ever by integrating the complete graphics, video, and audio functionality on-chip to save design costs and simplify assembly.

Accordo 5 devices provide features that have high value for car drivers, including smartphone mirroring that gives access to content such as music and navigation services on the phone safely through the vehicle’s own user interface. The state-of-the-art host processor and high-performance video and graphics engines can present complex information displays, such as simultaneous user-interface plus rear-view camera with navigation and video preview. There is also video playback for major formats including H.264 and DivX®, 2D and 3D graphics with effects such as blending and overlays, as well as USB connections and SD-Card interfaces.

Less visible to users, but critically important to today’s increasingly connected cars, Accordo 5 chips integrate a high-performance microcontroller that secures the interface between the head unit and the main vehicle network. Built-in features of this microcontroller include boot-code authentication, secure interconnect, and high-performance data encryption.

“Replacing conventional dials, switches, and indicator lamps with advanced graphical instrumentation gives drivers more convenient access to information about the vehicle and surroundings, and digital head units can enhance safety and convenience. By integrating state-of-the-art features in a cost-effective single-chip solution, our Accordo 5 family now enables car makers to deliver such benefits to more customers in more markets than ever before,” said Fabio Marchio, Automotive Digital Division General Manager, Automotive & Discrete Group Vice President, STMicroelectronics.

Further technical information:
The Accordo 5 family is the latest generation of ST’s successful Accordo line and leapfrogs other digital-infotainment chips, leveraging ARM® Cortex®-A7 processor as the main computing CPU. The Cortex-A7 architecture is highly area-efficient, and therefore cost-effective, with high processing and memory-streaming performance. The Accordo 5 range gives designers a choice of single-core Cortex A7 with a 16-bit interface to high-performing off-chip DDR3, or dual-core Cortex-A7 with a 16/32-bit DDR3 interface.

Although targeting mid-range vehicle markets, Accordo 5 delivers best-in-class graphics performance from its 500MHz 3D graphics processor core. The architecture supports 2D and 3D graphics up to 1080p resolution, in well-known formats like OpenVG, OpenGLES-2.0, and is capable of effects such as flexible blending of up to four layers with multiple modes and video overlay. The multi-format video subsystem provides post-processing for effects such as picture-in-picture, and virtuoso audio performance comes from a high-performance audio DSP, six stereo-audio analog channels, and support for multiple industry-standard audio interfaces. The built-in display controller supports TFT-LCD touch panels up to Full HD definition.

The new family further strengthens security by dedicating an ARM Cortex-M based microcontroller for managing the secure CAN interface between digital instruments and the main vehicle network. This microcontroller integrates three CAN ports including support for the latest CAN FD high-speed standard, a hardware accelerator for crypto algorithms including SHA-2, PK and AES, and One-Time-Programmable (OTP) memory for master-key storage and tamper prevention. The microcontroller draws very little current in standby mode, and complements careful power management throughout the chip to minimize drain on the vehicle’s electrical supply.

Additional advances include increased thermal dissipation versus execution performance, which helps simplify thermal management for optimum reliability, as well as flexible signal routing that simplifies audio design.

ST supports designers using the new chips with comprehensive software and middleware IP that streamlines the design of feature-rich displays and instruments.

The Accordo 5 family comprising the STA1275, STA1285, and STA1295 is in sampling phase now. The STA1295 with dual-core Cortex-A7 processor is available in a 19mm x 19mm x 1.7mm LFBGA529 package. Please contact your local ST sales office for pricing options and further information.

Low-Power, Long-Range Radio Chip from STMicroelectronics Extends the Reach of the IoT, Adds Support for Sigfox Global Network

v Ultra-low-power design for prolonged battery lifetime in applications with sensors in the Smart Home, Smart City, and Smart Industry

v Built-in support for Sigfox simplifies access to reliable, efficient, and cost-effective IoT connectivity

v Programmable device supports multiple protocols and multiple sub-1GHz Industrial, Scientific and Medical (ISM) frequency bands

The latest radio chip for the Internet-of-Things (IoT) from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, delivers extremely high energy efficiency for smart connected objects to operate for up to 10 years without replacing batteries.

ST’s new S2-LP transceiver is ideal for networked devices, such as alarm systems, surveillance equipment and smart energy-metering solutions, as well as long-range radio links used to connect devices like remote sensors directly to the Cloud without a local gateway. Other applications include building automation, industrial monitoring and control, and systems for managing lighting, traffic, or parking in smart cities.

The device operates in unlicensed sub-1GHz frequency bands, which are available globally. Ultra-narrowband operation allows highly efficient use of radio spectrum and reliable data exchange up to long distances using low-power signals.

In addition, the transceiver enables connectivity to the Sigfox global network, which is being rolled out worldwide to provide a reliable cost- and energy-efficient communication solution for billions of sensors and smart things.

“Building on our strengths in MEMS Sensors, Analog and Microcontrollers, in 2009 we saw the coming need to support emerging IoT applications with a low-power ISM radio for medium-long-range wireless connections and we developed and introduced our own SPIRIT1 low-power sub-1GHz radio that is currently in many applications available in the market,” said Benedetto Vigna, Executive Vice President, General Manager, Analog and MEMS Group, STMicroelectronics. “Now, in partnership with Sigfox, we are opening a new era in ISM radios for the IoT to extend battery life from months to more than 10 years while preserving the robustness and reliability of the connection and reducing maintenance costs for remote and difficult-to-reach sensors.”

Tony Francesca, Vice President of Global Ecosystem Partners at Sigfox added, “Our global network, which has been optimized for the lowest device energy consumption and cost, provides an entirely new way of connecting the physical world to the Cloud. ST’s support for Sigfox, integrated in the new S2-LP radio device, will help system designers bring their IoT concepts to life by leveraging the benefits of our fast global infrastructure and ecosystem.”
The S2-LP long-range, low-data-rate transceiver is in production now in a 4mm x 4mm QFN24 package, priced $1.15 for orders of 1000 pieces.

Technical Notes

The S2-LP transceiver is a highly integrated device made possible by ST’s wide-ranging competencies including low-power RF analog design and integration with digital blocks comprising the radio baseband. It:
· Supports point-to-point, star, as well as mesh networking topologies thus resulting in a very flexible wireless transceiver for connected objects.

· Delivers extremely low power consumption, drawing only 6.7mA in receive mode, and 10mA when transmitting at 10dBm. Sleep and standby modes reduce the current to just 600nA and 350nA, respectively.

· Receiver sensitivity of -130dBm enables operation over distances up to several hundred kilometers, depending on the environment, thus enabling wide-area coverage.

· Is a flexible solution that can be programmed for operation in multiple worldwide sub-1GHz ISM frequency band: support for Sigfox, Wireless M-Bus and 6LowPAN, as well as IEEE 802.15.4g, which is suitable for home energy-management systems.

· Leverages a full-featured Software Development Kit (SDK) compatible with the STM32 microcontroller family that has proven credentials in the energy-conscious IoT space, and with the extensive STM32 development ecosystem including prototype boards and rich software tools and resources.

· Is Sigfox-ready and comes with a pre-certified Development Kit enabling immediate connectivity to the Sigfox network for evaluation and easy prototyping purposes.

STMicroelectronics and WiTricity to Develop Integrated Circuits (ICs) for Resonant Wireless Power Transfer

• Chips to accelerate the adoption of wireless charging, with ability to efficiently charge metal-body consumer electronics
• Opportunities include consumer electronics, Internet of Things, mobile computing, automotive, medical, and industrial applications

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and WiTricity, the industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer. The goal is to “cut the last cord,” bringing convenience to the powering and charging of consumer electronics, Internet of Things (IoT) devices, as well as medical, industrial, and automotive applications.

WiTricity and ST are developing semiconductor solutions that combine WiTricity’s foundational intellectual property and wireless power-transfer mixed-signal IC-design expertise, with ST’s leadership in power-semiconductor design, fabrication, and packaging capabilities and resources. For the consumer electronics and IoT markets, power transmit and receive systems built with these new semiconductors aim to deliver spatial freedom, as well as wireless fast charging of one or more devices at the same time. Dubbed “Wireless Charging 2.0,” the semiconductor solutions built with the magnetic resonance technology will also have unique advantages over current technology, including being able to efficiently charge metal-body smartphones, tablets, and smartwatches.

The contemplated semiconductor offerings include designs that comply with the AirFuel™ magnetic resonance specification as well as multi-mode solutions that incorporate both resonant and inductive charging. The AirFuel Alliance, a global organization dedicated to delivering the best wireless-charging experience for consumer electronics, is driving an interoperable ecosystem of wireless-charging Power Transfer Transmit Units (PTUs) and Power Receive Units (PRUs) that enable users to charge their devices everywhere; in their homes and offices to public spaces and even in their vehicles.

Beyond the consumer market, WiTricity is the global technology leader in wireless power for automotive, industrial and medical applications. ST and WiTricity demonstrated high-power wireless-transfer technology for electric vehicle charging at APEC 2016 in Long Beach California. For the automotive industry, WiTricity recently announced wireless “park-and-charge” development kits using their industry-leading 11kW solution for electric- and hybrid-vehicle charging. The solution has successfully been tested by the Society of Automotive Engineers (SAE) for inclusion in a new global standard.

“Combining the expertise of WiTricity, the innovator in wireless power-transfer and magnetic resonance technology with ST’s resources and key IP, including Smart Power technologies and RF Bluetooth low energy, allows us to deliver complete, efficient wireless-charging solutions that increase convenience and ease of use while delighting consumers and exceeding their expectations,” said Matteo Lo Presti, Vice President and General Manager, Analog, in the Analog and MEMS Group, STMicroelectronics. “Game-changing technology from this ST and WiTricity collaboration will enable product designers across the globe to rid the world of cumbersome wires and charging cables and allow us to promote a broader set of our own semiconductor offerings into these emerging markets.”

“STMicroelectronics is a global leader in semiconductor solutions for power electronics and a compelling choice to rapidly commercialize fast and efficient wireless-charging chipsets based on WiTricity’s silicon designs and magnetic-resonance technology,” said Alex Gruzen, CEO of WiTricity. “With ST’s vast experience in semiconductor design and fabrication, as well as its access to leaders in the consumer electronics, automotive, and industrial markets, this collaboration puts us in a strong position to accelerate the adoption of resonance-enabled wireless charging.”

STMicroelectronics’ Semiconductor Chips Contribute to Connected Toothbrush from Oral-B

STMicroelectronics’ Semiconductor Chips Contribute to Connected Toothbrush from Oral-B That Sees What You Don’t
Microcontroller and Accelerometer help brushers clean their teeth more effectively

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today revealed its contributions to an intelligent toothbrush system from Oral-B. ST’s motion-sensing and control chip inside the toothbrush help develop healthier brushing habits.

Brushing incorrectly can negatively affect oral health. To help people brush like their dental professional recommends and avoid these common oral-health issues, the Oral-B GENIUS intelligent toothbrush system combines revolutionary Position Detection technology with Triple Pressure Control and a Professional Timer.

ST’s low-power 3-axis accelerometer captures permanently the orientation of the toothbrush handle while the user is brushing. ST’s 8-bit STM8 microcontroller performs pre-processing of the accelerometer data and other housekeeping functions on the GENIUS toothbrush and leverages ST’s advanced packaging technologies for miniaturization.

“Our contribution to improving personal healthcare through an electronic toothbrush that brushes like your dental professional recommends is yet another example of how semiconductor technologies help people get more from life,” said Kevin Gagnon, Vice President of Central Sales, Americas Region, STMicroelectronics. “A powerful demonstration of the exceptional creativity of the Oral-B technology team, the GENIUS smart electronic toothbrush is a testament to the variety of highly innovative products that ST’s solutions can be used to develop and bring to market.”

STMicroelectronics Promotes New Digital Age in India

ST showcases its latest technologies and products for the Internet of Things and Smart Driving at electronica India 2016

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is showcasing its latest technologies and products for Smart Driving, Smart Cities and Homes, and Smart Things at electronica India in the Bangalore International Exhibition Center, Hall E2, Booth 2072, September 21-23, 2016.

ST’s Smart Driving solutions focus on increasing safety and security with Assisted Driving, enhancing engine efficiency and accelerating vehicle electrification with Green Driving, and improving comfort and convenience with telematics and infotainment in Connected Driving. Similarly, ST’s offering for Smart Cities and Homes addresses energy efficiency along the entire power lifecycle through high-efficiency power supplies and energy-management technologies, smart (LED) lighting, and home automation. ST also provides all the building blocks for applications that make up the vast universe of Smart Things in our homes, offices, streets, and cars.

In particular, at electronica India 2016 ST is planning demonstrations that include:

· A USB Type-C™ and Power Delivery evaluation board;
· STM32F4 32-bit microcontrollers that enable voice recognition and sensor fusion;
· An STM32L0 MCU sensor node with LoRa® wireless Low-Power Wide Area Network (LPWAN) connectivity for long-distance IoT (Internet of Things) object communication;
· Rich-touch GFX graphics on the STM32F7 evaluation kit and a number of other innovative embedded applications and tools;
· Solutions demonstrating the transfer of sensor data, voice, and software libraries to a smartphone through Bluetooth Low Energy;
· A smart-watch reference design with sensor fusion and associated libraries;
· ST25 NFC/RFID tags used for syncing smart-watch data with an NFC phone and for downloading and installing apps on Smart Home gateways;
· An NFC-enabled smart-lock solution and a programmable LED fan showcasing the ability to upgrade firmware in no-power mode;
· A broad range of components that address motor-drive ICs, low-voltage Power MOS, 32-bit STM32 microcontrollers, and Wi-Fi modules; a 1200V SiC MOSFET; DC-DC bi-directional converters for HEVs; highly efficient dimmable LED drivers with wireless remote control; and cost-optimized 3-phase motor controls;
· And, to highlight its contributions to Smart Driving, a complete module that controls major car-body functions, including exterior/interior lamps, central lock, front and rear wipers, power window controls, Remote Keyless Entry, LIN and high-speed CAN communication; dashboard solutions based on ST’s SPC5 32-bit Power Architecture™ microprocessor platform; processors for car-radio and display, telematics and connectivity (V2X) applications; Active Safety features for Advanced Driver Assistance Systems (ADAS); a fully integrated 24-GHz transceiver for automotive radar applications.

The STM32, which is the industry’s most comprehensive platform of 32-bit ARM® Cortex®-M microcontroller devices covering mainstream, high-performance, and low-power embedded applications, will be prominently featured on ST’s booth at electronica India 2016. STM32 MCUs have penetrated into all key applications of IoT including wearables, portable healthcare, smart home, smart energy, and smart transportation. This broad penetration has been facilitated by STM32 users having access to a strong development ecosystem built in cooperation with local software, hardware, and solution providers, design companies, and distributors, supported by innovative business models and complementary value chain.

electronica India 2016 and productronica India 2016 return to become the biggest ever trade fairs in the Indian ESDM industry

electronica India 2016 and productronica India 2016, the leading trade fairs for electronic components and manufacturing technologies take place from September 21-23, 2016 at Bangalore International Exhibition Centre (BIEC) in Bangalore. This edition is set to be the biggest edition of the trade fairs marked by over 400 exhibitors representing 650 companies from 16 countries including Japan, France, Korea, Malaysia, Switzerland to name a few. The trade fairs will also see country pavilions from six countries, Germany, UK, China, Taiwan, Singapore and Hong Kong.

The participation of leading exhibitors from across the industry reaffirmed the need and focus of electronica India 2016 and productronica India 2016 as an industry event. These include Murata, Rohm, STMicroelectronics, Texas Instruments, Bosch, NXP, Master Instruments Corporation, Juki India, NMTronics, Panasonic India, Samsung, Maxim SMT, Kaynes Technologies, Sahasra, Transtec, Mycronic, Komax, Atotech, Leaptech, SGS Tekniks, and many more.

Concurrent to the trade fairs, there will be various conferences, a buyer-seller forum, a B2G (business to government) forum, and exclusive pavilions from IPC India and CLIK (Consortium of Electronic Industries of Karnataka).

The trade fairs for the first time will have participation from various Indian states including Rajasthan, Chhattisgarh, Haryana, Jharkhand, Odisha, Madhya Pradesh in the State Pavilion. ELCINA and Messe München India have jointly organized Invest India – a CEO forum, wherein the states will bring in attractive investment opportunities in the Electronics System Design & Manufacturing (ESDM) space to domestic as well as global manufacturing firms.

The electronics market in India is expected to reach USD 400 billion by 2020 and PCB, being the backbone of almost all electronics product – hold huge growth potential in India. As per ELCINA’s research, the PCB industry in India is expected to grow up to USD 6 billion by 2020. Messe München India and ELCINA are jointly introducing ‘India PCB Tech’, which will showcase the PCB technologies from the best manufactures and their suppliers from across the globe to cater to the growing demand of PBCs in various industry segments. The joint initiative will bring the entire PCB industry eco-system and related supply chain together.

The trade fairs are largely supported by the Ministry of Electronics and Information Technology (MeitY), and leading national and international associations such as the Electronic Industries Association of India (ELCINA), India Electronics & Semiconductor Association (IESA), National Small Industries Corporation (NSIC), Consumer Electronics and Appliances Manufacturers Association (CEAMA), the Consortium of Electronic Industries in Karnataka (CLIK), the German Electrical and Electronic Manufacturers Association (ZVEI) and many more, resulting in the outstanding quality of electronica India and productronica India.

According to Mr. Bhupinder Singh, CEO, Messe München India, “electronica India and productronica India have been promoting electronics manufacturing in India by attracting the leading electronic companies from across the globe to showcase their latest technologies in the Indian market and partner with the domestic manufacturing companies. This year, we have reached an important milestone by being the biggest ever edition and to ensure return on our exhibitors’ investments, we will be organizing the largest ever buyer-seller forum wherein India’s largest manufacturing companies from various segments viz. EMS, automotive, consumer electronics, defense and aerospace, industrial electronics etc. will make their sourcing decisions. Considering Indian Government’s ‘Make in India’ initiative to encourage domestic manufacturing and to invite the investors, we are organizing the biggest ever investor summit in the ESDM segment with the participation from 10 states, creating tremendous business opportunities for the stakeholders”

electronica India and productronica India 2016 will showcase latest offerings in categories including semiconductor and display manufacturing, soldering technology, PCB and other circuit-carrier manufacturing, test and measurement, quality assurance, Electronic Manufacturing Services (EMS), production materials/equipment, environmental technology and clean-room technology, organic and printed electronics etc with exhibitors from across the industry. The trade fairs will be held in conjunction with LASER World of PHOTONICS INDIA 2016 and creating attractive synergies and added value for visitors.