Versatile Accelerometer from STMicroelectronics Delivers Class-Leading Resolution and Low Power in Tiny Footprint

Taking context sensing in Internet-of-Things (IoT) and wearable devices to the next level, STMicroelectronics’ LIS2DW12 3-axis accelerometer delivers superior accuracy, flexibility, and energy savings by supporting multiple low-power and low-noise settings in a 2mm x 2mm x 0.7mm package.

A new member of ST’s low-power, high-performance MEMS product family (alongside devices like LSM6DSM, LSM6DSL, and LSM303AH), the LIS2DW12 has 16-bit output and can be set to prioritize low power consumption or low-noise performance, with five settings in either mode. A specific feature coupled with four settings in each mode save waking the system to check for data, and allow efficient single-byte transfers thereby further minimizing system power consumption and helping extend battery life. Noise density down to 90µg/√Hz is at least 25% lower than similar devices in the marketplace, which improves the measurement accuracy in next-gen applications from healthcare, fitness, and gaming to industrial sensing and environmental monitoring.

Drawing as little as 50nA in standby, or 380nA in low-power mode at 1.6Hz Output Data Rate, the LIS2DW12 adds negligible load on the battery. The supply-voltage range of 1.62-3.6V allows extended operation from small coin or button cells. Features that support system-level power savings include a 32-level FIFO, a built-in temperature sensor, and a programmable interrupt for freefall, wake up, activity/inactivity, 6D/4D orientation detection, and tap/double-tap detection.

The LIS2DW12 offers high resolution and flexibility to optimize noise performance and power consumption in a small 2mm x 2mm x 0.7mm package.

Engineering samples of the LIS2DW12 are available now, and volume production will begin in Q1 2017. Budgetary pricing is from $0.75 for orders of 1000 pieces.

For further information please visit www.st.com/lis2dw12-pr

STMicroelectronics’ MCU Finder for PC Connects Conveniently to STM32 and STM8 Design Resources Directly on Developer’s Desktop

STMicroelectronics has released its MCU Finder for PC, enabling embedded developers to access essential STM32 32-bit ARM® Cortex®-M and STM8 8-bit MCU (microcontroller) information conveniently from the same desktop environment used for application development.

Leveraging features of ST’s popular MCU Finder mobile app (ST-MCU-FINDER), the PC version (ST-MCU-FINDER-PC) provides easy-to-use selection tools, self-maintaining documentation, and connections to MCU communities. It is available for Windows®, macOS™, and Linux® platforms, enabling embedded developers to consolidate all their MCU resources including data and tools on the desktop for convenience and efficiency.

Users can search the entire range of over 700 STM32 and over 125 STM8 MCU part numbers, based on up to 54 criteria for the STM32 and 20 criteria for the STM8 family. These criteria cover the full range of device features, including core type, CPU frequency, memory, price, package, I/Os, temperature grade and peripherals such as control, timers, analog, connectivity, multimedia and security. Development can begin immediately after device selection by downloading the STM32CubeMX initialization-code generator directly from the MCU Finder for PC.

The desktop application helps developers quickly find the data and technical resources they need to support their microcontroller projects. All the documentation for any selected device can be seen in one place, with one click, and downloaded for offline viewing. Documents are automatically updated with the latest versions, so developers can be sure the most accurate information is always loaded on their PC without making repeated online searches. Users can also quickly check prices and buy devices online.

Like ST’s popular MCU Finder mobile app for Android and iOS, the desktop version also connects users with developer communities on popular social platforms such as Facebook, Twitter, STM32’s YouTube channel and the new ST Community of more than 40,000 members.

ST’s MCU Finder for PC is available now, and can be downloaded free of charge from www.st.com/stmcufinder

3MHz Chopper Op Amps from STMicroelectronics Feature Rail-to-Rail Input and Output in Tiny Footprint

The TSZ182 dual precision op amp from STMicroelectronics combines low and extremely temperature-stable input-offset voltage with the added advantages of a 3MHz gain-bandwidth, rail-to-rail inputs and outputs, and ultra-small 2mm x 2mm DFN8 or Mini-SO8 package options.

Complementing ST’s popular conventional op amps, the chopper-stabilized TSZ182 enables superior precision in instruments like body-signal monitors, blood-glucose meters, industrial sensors, factory automation, and low-side current sensing.

The offset voltage of 25µV at 25°C enables high measurement resolution and accuracy without external trimming components, saving board space and the need for adjustments during production. Moreover, offset drift less than 100nV/°C maintains accuracy over a wide temperature range and saves periodic auto-recalibration thereby simplifying design and enhancing convenience for end users.

Operating from a 2.2V-5.5V supply and providing rail-to-rail inputs and outputs – a competitive advantage over some other precision op amps – the TSZ182 maximizes utilization of available dynamic range. The gain-bandwidth of 3MHz ensures consistent frequency response over a wide range, and the maximum operating current of just 1mA at 5V helps maximize runtime of battery-powered devices.

The extended operating-temperature range of -40°C to 125°C enables use in harsh outdoor or industrial environments. Automotive-qualified variants (TSZ1821IYST) will also be available next month for precision sensor-signal conditioning in equipment ranging from simple wiper modules or climate controls to autonomous-driving systems.

The TSZ182 is in production now in the Mini-SO8 or DFN8 2mm x 2mm package, priced from $0.97 for orders of 1000 units.

For further information please visit www.st.com/tsz182-pr

STMicroelectronics Boosts Feature Integration, Efficiency, and Flexibility of Next-Generation Intelligent Power Modules up to 100W

STMicroelectronics has extended its SLLIMM™ nano series of Intelligent Power Modules (IPMs) for motor drives with more package options that help minimize overall size and complexity, extra integrated features, and greater efficiency leveraging the latest-generation 500V MOSFETs.

With a current rating of 1A or 2A, the new IPMs target applications up to 100 Watts, such as refrigerator compressors, washing-machine or dishwasher motors, draining and recirculation pumps, fans, and other drives running at less than 20kHz in hard-switching circuitries. Operation up to 150°C allows use in harsh environments.

The modules integrate a three-phase MOSFET bridge and gate-driver HVICs, with value-added features including an unassigned op-amp and comparator for functions such as over-current protection and current sensing. Additional built-in safety features include interlocking to prevent shoot-through currents from damaging MOSFETs of the bridge, a fault-status output, shutdown input, and smart-shutdown capability. An optional built-in thermistor helps simplify over-temperature protection.

In addition to the zig-zag lead option, the new series is also available in a line-lead package. These give designers extra flexibility to simplify the board layout and minimize controller size in mechatronic assemblies and other space-constrained applications.

The high thermal performance of the packages, combined with the superior efficiency of ST’s latest 500V MOSFETs, enhances designers’ freedom to minimize heatsink size or create heatsink-free solutions for lower-power applications. The low MOSFET on-resistance of 3.6Ω and 1.7Ω, in 2A and 1A variants, respectively, combines with low switching losses to ensure high overall energy efficiency. The MOSFETs have separate open-emitter connections to module pins, which simplifies use of three-shunt current sensing for field-oriented motor control (FOC) or single-shunt sensing for trapezoidal control. The modules also integrate the bootstrap diodes needed to control the high-side MOSFET gates, further minimizing demand for external components.

The STIPN1M50T-H, STIPN1M50-H, STIPN2M50T-H (L), and STIPN2M50-H are in production now, priced from $4.50 in the Dual Inline Package for orders of 1000 pieces.

For further information please visit www.st.com/ipm

High-Temperature Silicon Power Switches from STMicroelectronics Enhance Reliability in Motorcycles and Industrial Applications

High-temperature Silicon-Controlled Rectifiers (SCRs) from STMicroelectronics allow manufacturers of voltage regulators, inrush current limiters for switch-mode power supplies, motor-control circuits, and industrial solid-state relays to improve the reliability of their applications and/or reduce costs by using smaller heatsinks.

Addressing a wide range of industrial and two- and three-wheel vehicle applications, ST’s high-temperature SCRs are particularly well suited to voltage regulators in markets where cost efficiency and high reliability are key requirements.

Operating with junction temperatures of up to 150oC, the TN4015H SCRs offer on-state RMS current ratings of 40A, extending and complementing the existing 12A – 20A product range. They are designed to offer tight control of the gate triggering current, leading to enhanced reproducibility on the customers’ assembly lines with corresponding improvements in the reliability of the end products. The new SCRs are also more gate-sensitive compared with previous generations, while delivering best-in-class electrical noise immunity.

Other key technical features include:
High noise immunity (dV/dt up to 1000V/μs);
600V blocking voltage;
High turn-on current rise (dI/dt = 100 A/μs);
ECOPACK®2 packaging for compliance with safety regulations and faster certification;
Available in various power packages, with UL 1557-certified[1] insulated packages withstanding up to 2500 VRMS.

The TN4015H 40A SCRs are available now in volume production in D2PAK, TO-220AB, and TO-220AB insulated packages, priced from $0.507 for 1,000 unit orders.

For more information, please go to www.st.com/tn4015h-nb

STMicroelectronics Teams with Mobile-Payment Partners to Create Turnkey, Certification-Ready Solution for Wearable Devices

· ST, Giesecke & Devrient (G&D), and FitPay join forces to overcome traditional barriers to OEMs implementing payment applications on wearable devices
· Groundbreaking secure solution with Secure Element pre-approved for use with devices to integrate tokenized payments from Mastercard or Visa
· Turnkey solution combines all necessary firmware, software, and hardware, including ST’s trusted security chip

Mobile payments may go mainstream on wearable devices like smartwatches by taking advantage of a new ready-to-use payment solution containing technology from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

ST, G&D, and FitPay have used ST’s security chip to jointly create the first secure hardware and software solution that is pre-approved for use by device manufacturers with the aim to develop integrated tokenized payments from Mastercard or Visa. This effort reduces the well-known barriers to implementing card payments on mobile devices and enables wearable-device OEMs to concentrate on product development. The joint solution gives users the flexibility to load multiple payment cards from various banks and from different payment networks onto the wearable, making contactless payments easy, independent of the end-device’s operating system.

A secure operating system (G&D), payment application management software (FitPay), and hardware components needed to support a mobile payment application are included and fully integrated around ST’s trusted ST54E security chip (embedded Secure Element, eSE) that handles cryptographic processing and tamper-proofing.

ST has leveraged the breadth of its component portfolio to satisfy all functional requirements for a payment device. Alongside the ST54E, the reference design contains the STS39230 NFC booster that supports contactless connection to the payment terminal and allows a small-size antenna, an LIS2DS12 MEMS accelerometer that enables gesture-activated payment, Bluetooth® Smart ICs, a USB battery charger, and an energy-saving microcontroller from ST’s ultra-low-power STM32L4 line.

Michael Orlando, CEO of FitPay, said: “Wearable devices are transforming the payment experience, and FitPay, ST, and G&D are making it easier to develop payment-enabled wearables. This reference design from ST demonstrates a fully integrated payment solution for manufacturers.”

G&D’s mobile-payment solutions are commercially proven and support payments at contactless-enabled merchant locations around the world. Axel Deininger, Executive Vice President and Head of G&D’s Enterprise Security/OEM division said, “The integration work we have done together with ST and FitPay to create this reference design overcomes the critical road blocks to delivering the freedom of mobile payments for consumers worldwide.”

“Our vision is to enable secure payments to a generation of new devices, giving consumers around the world new and innovative ways to pay,” said Kiki Del Valle, Senior Vice President, Commerce for Every Device at Mastercard. “Mastercard created a standard for expanding secure contactless and embedded payment options globally, and STMicroelectronics and its partners have created an intelligent and powerful solution to mobile-payment challenges – that leverages our tokenization service – to deliver secure and trusted payments-enabled devices.”

“As the market for payment-enabled wearables grows, manufacturers need easy ways to bring secure transactions and connectivity to their devices,” said Avin Arumugam, Senior Vice President, Internet of Things (IoT), Visa Inc. “The solution ST and its partners are offering is a critical step in bringing contactless Visa payments to a whole new generation of IoT devices.”

Laurent Degauque, Marketing Director, Secure Microcontroller Division, STMicroelectronics, said, “The market has been waiting for a turnkey reference design that greatly simplifies the way device OEMs interact with the payment ecosystem and this effort fits the bill. It provides everything needed for wearables to become the devices that will make mobile payments ubiquitous, simple, safe, and secure.”

The ST54E is available now. Contact ST Sales for pricing.

Miniature Multi-Sensor Module from STMicroelectronics Jumpstarts IoT and Wearable Designs

· Sensing and connectivity hub ideal for developing products such as wearables, gaming accessories, smart-home and IoT devices
· Leverages powerful open software ecosystem for faster time to market

STMicroelectronics’ 13.5mm x 13.5mm SensorTile is currently the smallest turnkey sensor board of its type, containing a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone. With the on-board low-power STM32L4 microcontroller, it can be used as a sensing and connectivity hub for developing products such as wearables, gaming accessories, and smart-home or Internet-of-Things (IoT) devices.

SensorTile has a complete Bluetooth® Low-Energy transceiver including a miniature single-chip balun on-board, as well as a broad set of system interfaces that support use as a sensor-fusion hub or as a platform for firmware development. It can be simply plugged to a host board, and when powered it immediately starts streaming inertial, audio, and environmental data to ST’s BlueMS smartphone app that can be downloaded free of charge from popular app stores.

Software development is fast and easy thanks to a vast ecosystem of Application Program Interface (API) based on the STM32Cube Hardware Abstraction Layer and middleware components, including the STM32 Open Development Environment. The system is fully compatible with the Open Software eXpansion Libraries (Open.MEMS, Open.RF, and Open.AUDIO), as well as many third-party embedded sensing and voice-processing projects. Many example programs available in source code offer a starting point for evaluation and customization, including software for position sensing, activity recognition, and low-power voice communication.

The complete kit includes a cradle board, which carries the 13.5mm x 13.5mm SensorTile core system in standalone or hub mode and can be used as a reference design. This compact yet fully loaded board contains a humidity and temperature sensor, a micro-SD card socket, as well as a lithium-polymer battery (LiPo) charger. Its simple layout demonstrates how a complete wearable prototype customized with extra functionalities can be easily designed with the SensorTile core system.

The pack also contains a LiPo rechargeable battery and a plastic case that provides a convenient housing for the cradle, SensorTile, and battery combination.

Also part of the SensorTile kit is a cradle/expansion board with an analog audio output, a micro-USB connector, and an Arduino-like interface that can be plugged into any STM32 Nucleo board to expand developers’ options for system and software development. A programming cable is also included.

The SensorTile kit (STEVAL-STLKT01V1) is available now from distributors or can be purchased directly from st.com, priced at $89.00.

Main features of SensorTile core system:

· LSM6DSM 3D accelerometer + 3D gyroscope
· LSM303AGR 3D Magnetometer + 3D accelerometer
· LPS22HB pressure sensor/barometer
· MP34DT04 digital MEMS microphone
· STM32L476 microcontroller
· BlueNRG-MS network processor with integrated 2.4GHz radio

For further information please visit www.st.com/sensortile

STMicroelectronics Boosts Trusted Computing with New Advanced Security Modules

v Expansion of STSAFE family with latest Trusted Platform Modules (TPMs) extends support for state-of-the-art hardware-based online security

v Largest on-chip memory in the market provides greater storage for sensitive data

v Devices are certified to highest security-industry standards and supported by independent Certification Authority (CA)

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and an active member of the Trusted Computing Group (TCG) for more than a decade, has introduced two state-of-the-art security modules that provide an industry-validated shield to protect computers and smart connected devices against cyber-attacks.

The new STSAFE Trusted Platform Modules (TPM) store system-authentication data such as cryptographic keys and software measurements in inaccessible and unalterable hardware, offering an industry-standardized way to protect PCs and servers, as well as other home and office equipment such as printers, copiers, home gateways, network routers, and switches. This protected storage prevents attackers from interfering with the device’s integrity, stealing private data, or taking over the system to gain unauthorized access or privileges that would put the system, data, or its network at risk.

“Robust security is central to maintaining trust in the rapidly growing number of smart connected devices that support the way we live and work,” said Marie-France Florentin, General Manager, Secure Microcontrollers Division, STMicroelectronics. “Our state-of-the-art security modules combine the latest trusted computing technology with value-added features that enable superior protection for end-users’ privacy and safety.”

The Trusted Computing Group’s latest TPM 2.0 specification adds extra features over and above the earlier TPM 1.2[1], including cryptographic algorithms and support for user hierarchies. The first of ST’s new STSAFE-TPM devices, the ST33TPHF2ESPI, supports both specifications and can switch easily between the two, allowing OEMs to provide TPM 1.2 or TPM 2.0 capability on the latest device technology. The second device is the ST33TPHF20SPI, which supports TPM 2.0 and has the largest non-volatile memory in the market to provide up to 110Kbytes storage for sensitive data.

The STSAFE-TPM modules leverage ST’s expertise with the secure ARM® SecurCore® SC300™ processor, which has anti-tamper, data-watching, and memory-protection features. Both devices are Common Criteria (CC) and Trusted Computing Group (TCG) certified against the applicable TPM 1.2 and 2.0 protection profiles and US Federal Information Processing Standard (FIPS) 140-2 certifications are in progress. The new modules come with RSA and ECC[2] Endorsement Keys[3] (EKs) needed to support authentication and associated key certificates are provided, signed by the independent certification authority Globalsign Ltd to guarantee authenticity.

The ST33HTPH2ESPI and ST33HTPH20SPI are available in either a TSSOP28 or QFN32 package. Both devices are in production now. Please contact your ST sales office for pricing options and sample requests.

STSAFE is a family of authentication products offering turn-key solutions. All STSAFE products rely on highly secure MCUs that achieve top-level Common Criteria EAL5+ certification, as certified by independent labs. The STSAFE product family is aimed at offering well-tailored solutions to meet the increasing security challenges in Trusted Computing, Brand Protection, and the IoT.

New Automotive Chips from STMicroelectronics Bring High-End Graphics, Audio, and Video to Entry and Mid-Range Vehicles

v Advanced chip integration brings full-digital head unit with features like smartphone mirroring to cost-conscious vehicle markets

v High-performing multi-processor architecture ensures high graphics, video, and audio quality

v Dedicated on-chip microcontroller with crypto acceleration ensures best-in-class security

Full-digital instrument panels that give a high-end feel to any car are coming to the mid and entry ranges, enabled by new technology from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top supplier of advanced automotive ICs.

ST’s new Accordo 5 family of automotive processors meet crucial display-performance and security demands in a low-power compact platform suitable for lower-cost vehicles.

The devices enable state-of-the-art digital instrument clusters and Audio/Video/Navigation (AVN) head units to become more affordable than ever by integrating the complete graphics, video, and audio functionality on-chip to save design costs and simplify assembly.

Accordo 5 devices provide features that have high value for car drivers, including smartphone mirroring that gives access to content such as music and navigation services on the phone safely through the vehicle’s own user interface. The state-of-the-art host processor and high-performance video and graphics engines can present complex information displays, such as simultaneous user-interface plus rear-view camera with navigation and video preview. There is also video playback for major formats including H.264 and DivX®, 2D and 3D graphics with effects such as blending and overlays, as well as USB connections and SD-Card interfaces.

Less visible to users, but critically important to today’s increasingly connected cars, Accordo 5 chips integrate a high-performance microcontroller that secures the interface between the head unit and the main vehicle network. Built-in features of this microcontroller include boot-code authentication, secure interconnect, and high-performance data encryption.

“Replacing conventional dials, switches, and indicator lamps with advanced graphical instrumentation gives drivers more convenient access to information about the vehicle and surroundings, and digital head units can enhance safety and convenience. By integrating state-of-the-art features in a cost-effective single-chip solution, our Accordo 5 family now enables car makers to deliver such benefits to more customers in more markets than ever before,” said Fabio Marchio, Automotive Digital Division General Manager, Automotive & Discrete Group Vice President, STMicroelectronics.

Further technical information:
The Accordo 5 family is the latest generation of ST’s successful Accordo line and leapfrogs other digital-infotainment chips, leveraging ARM® Cortex®-A7 processor as the main computing CPU. The Cortex-A7 architecture is highly area-efficient, and therefore cost-effective, with high processing and memory-streaming performance. The Accordo 5 range gives designers a choice of single-core Cortex A7 with a 16-bit interface to high-performing off-chip DDR3, or dual-core Cortex-A7 with a 16/32-bit DDR3 interface.

Although targeting mid-range vehicle markets, Accordo 5 delivers best-in-class graphics performance from its 500MHz 3D graphics processor core. The architecture supports 2D and 3D graphics up to 1080p resolution, in well-known formats like OpenVG, OpenGLES-2.0, and is capable of effects such as flexible blending of up to four layers with multiple modes and video overlay. The multi-format video subsystem provides post-processing for effects such as picture-in-picture, and virtuoso audio performance comes from a high-performance audio DSP, six stereo-audio analog channels, and support for multiple industry-standard audio interfaces. The built-in display controller supports TFT-LCD touch panels up to Full HD definition.

The new family further strengthens security by dedicating an ARM Cortex-M based microcontroller for managing the secure CAN interface between digital instruments and the main vehicle network. This microcontroller integrates three CAN ports including support for the latest CAN FD high-speed standard, a hardware accelerator for crypto algorithms including SHA-2, PK and AES, and One-Time-Programmable (OTP) memory for master-key storage and tamper prevention. The microcontroller draws very little current in standby mode, and complements careful power management throughout the chip to minimize drain on the vehicle’s electrical supply.

Additional advances include increased thermal dissipation versus execution performance, which helps simplify thermal management for optimum reliability, as well as flexible signal routing that simplifies audio design.

ST supports designers using the new chips with comprehensive software and middleware IP that streamlines the design of feature-rich displays and instruments.

The Accordo 5 family comprising the STA1275, STA1285, and STA1295 is in sampling phase now. The STA1295 with dual-core Cortex-A7 processor is available in a 19mm x 19mm x 1.7mm LFBGA529 package. Please contact your local ST sales office for pricing options and further information.

Low-Power, Long-Range Radio Chip from STMicroelectronics Extends the Reach of the IoT, Adds Support for Sigfox Global Network

v Ultra-low-power design for prolonged battery lifetime in applications with sensors in the Smart Home, Smart City, and Smart Industry

v Built-in support for Sigfox simplifies access to reliable, efficient, and cost-effective IoT connectivity

v Programmable device supports multiple protocols and multiple sub-1GHz Industrial, Scientific and Medical (ISM) frequency bands

The latest radio chip for the Internet-of-Things (IoT) from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, delivers extremely high energy efficiency for smart connected objects to operate for up to 10 years without replacing batteries.

ST’s new S2-LP transceiver is ideal for networked devices, such as alarm systems, surveillance equipment and smart energy-metering solutions, as well as long-range radio links used to connect devices like remote sensors directly to the Cloud without a local gateway. Other applications include building automation, industrial monitoring and control, and systems for managing lighting, traffic, or parking in smart cities.

The device operates in unlicensed sub-1GHz frequency bands, which are available globally. Ultra-narrowband operation allows highly efficient use of radio spectrum and reliable data exchange up to long distances using low-power signals.

In addition, the transceiver enables connectivity to the Sigfox global network, which is being rolled out worldwide to provide a reliable cost- and energy-efficient communication solution for billions of sensors and smart things.

“Building on our strengths in MEMS Sensors, Analog and Microcontrollers, in 2009 we saw the coming need to support emerging IoT applications with a low-power ISM radio for medium-long-range wireless connections and we developed and introduced our own SPIRIT1 low-power sub-1GHz radio that is currently in many applications available in the market,” said Benedetto Vigna, Executive Vice President, General Manager, Analog and MEMS Group, STMicroelectronics. “Now, in partnership with Sigfox, we are opening a new era in ISM radios for the IoT to extend battery life from months to more than 10 years while preserving the robustness and reliability of the connection and reducing maintenance costs for remote and difficult-to-reach sensors.”

Tony Francesca, Vice President of Global Ecosystem Partners at Sigfox added, “Our global network, which has been optimized for the lowest device energy consumption and cost, provides an entirely new way of connecting the physical world to the Cloud. ST’s support for Sigfox, integrated in the new S2-LP radio device, will help system designers bring their IoT concepts to life by leveraging the benefits of our fast global infrastructure and ecosystem.”
The S2-LP long-range, low-data-rate transceiver is in production now in a 4mm x 4mm QFN24 package, priced $1.15 for orders of 1000 pieces.

Technical Notes

The S2-LP transceiver is a highly integrated device made possible by ST’s wide-ranging competencies including low-power RF analog design and integration with digital blocks comprising the radio baseband. It:
· Supports point-to-point, star, as well as mesh networking topologies thus resulting in a very flexible wireless transceiver for connected objects.

· Delivers extremely low power consumption, drawing only 6.7mA in receive mode, and 10mA when transmitting at 10dBm. Sleep and standby modes reduce the current to just 600nA and 350nA, respectively.

· Receiver sensitivity of -130dBm enables operation over distances up to several hundred kilometers, depending on the environment, thus enabling wide-area coverage.

· Is a flexible solution that can be programmed for operation in multiple worldwide sub-1GHz ISM frequency band: support for Sigfox, Wireless M-Bus and 6LowPAN, as well as IEEE 802.15.4g, which is suitable for home energy-management systems.

· Leverages a full-featured Software Development Kit (SDK) compatible with the STM32 microcontroller family that has proven credentials in the energy-conscious IoT space, and with the extensive STM32 development ecosystem including prototype boards and rich software tools and resources.

· Is Sigfox-ready and comes with a pre-certified Development Kit enabling immediate connectivity to the Sigfox network for evaluation and easy prototyping purposes.