Telit Introduces World’s First Hybrid IoT Modules Combining 3G Cellular, Wi-Fi, Bluetooth and GNSS into a Single Package

IoT Cloud-ready, smart modules feature exclusive Intel® Atom™ x3 SoC Processor technology

Telit, a global enabler of the Internet of Things (IoT), today announced global commercial availability of the world’s first hybrid IoT modules that combine 3G Cellular, Wi-Fi, Bluetooth and GNSS into a single package. The new HE922-3GR and WE922-3GR smart module series in the xE922 family are also the first to use the Intel® Atom™ x3 SoC Processor technology with a self-contained quad-core processing engine and comprehensive I/O resources. Combined with the company IoT Portal and IoT Connectivity services, these modules deliver a complete end-to-end solution ideal for providers in a broad range of application areas including healthcare, vending, POS, public parking, smart buildings, smart grid and the industrial internet of things.

“The xE922-3GR products are game changers. When you look at how complexity of designing devices with multiple chipsets is impacting cost and time-to market, you can appreciate the power of these all-in-one hybrid modules,” said Ronen Ben-Hamou, Telit Executive Vice President of Products and Solutions. “It would take a good engineering team months to develop an IoT device prototype using disparate chips, whereas an engineer or two can now create a complete end-to-end IoT solution in just couple of weeks.”

“Across all industries and segments, businesses are always looking for shortcuts in traditional product development to get to market faster.” said Fred Yentz, Chief Executive Officer, Telit IoT Platforms. “With the combination of Telit’s Cloud-ready IoT modules, custom data plans, comprehensive IoT Portal, and unmatched IoT Know-How, we make it easy to connect, manage and integrate your ‘things’ with web-based or mobile apps or enterprise systems – providing the fastest path to business transformation, improved operational efficiencies and innovation in the market.”

Technical Specifications:
With a 34x40mm LGA footprint, the WE922-3GR and HE922-3GR deliver unparalleled features for their size. Both modules include 2.4GHz Wi-Fi 802.11 b/g/n and Bluetooth 4.0 LE. The embedded global positioning receiver in the modules is compatible with GPS and GNSS constellations. Both of them integrate the functionality of an entire processor board inside the 441-pin package based on the 1.2GHz, 64-bit, quad-core Intel® Atom™ x3 processor series and include 8GB memory, sensor inputs, battery charger logic, analog speaker and microphone audio connections, interface for primary and secondary cameras and direct support for high-resolution display with touch screen and/or keyboard. The application development environment is based on Android and Yocto Linux enabling access and reuse of vast libraries of functions and applications across all industries and segments. In addition to all of the above features, the HE922-3GR includes quad-band HSPA+ cellular connectivity delivering 21Mbps download data rate with fallback to 2G. The 3GPP Release 7 compliant HE922-3GR module supports 850/900/1900/2100MHz 3G HSPA+ bands with 850/900/1800/1900MHz 2G. The upload data rate is 5.76Mbps.

Both the WE922-3GR and HE922-3GR modules are available in two environmental grade variants. The commercial grade has an operating temperature range of 0°C to +70°C; the extended grade has an operating temperature range of -40°C to +85°C. The modules can be connected to an SD card and provide connections for a USB 2.0 port with OTG, two UART and SPI ports and I2C support.

A developers’ kit is also available for the modules which includes a high-resolution touch screen with embedded cameras and audio, all the necessary antennas and a power supply. A comprehensive set of application development tools is available online.

STMicroelectronics and WiTricity to Develop Integrated Circuits (ICs) for Resonant Wireless Power Transfer

• Chips to accelerate the adoption of wireless charging, with ability to efficiently charge metal-body consumer electronics
• Opportunities include consumer electronics, Internet of Things, mobile computing, automotive, medical, and industrial applications

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and WiTricity, the industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer. The goal is to “cut the last cord,” bringing convenience to the powering and charging of consumer electronics, Internet of Things (IoT) devices, as well as medical, industrial, and automotive applications.

WiTricity and ST are developing semiconductor solutions that combine WiTricity’s foundational intellectual property and wireless power-transfer mixed-signal IC-design expertise, with ST’s leadership in power-semiconductor design, fabrication, and packaging capabilities and resources. For the consumer electronics and IoT markets, power transmit and receive systems built with these new semiconductors aim to deliver spatial freedom, as well as wireless fast charging of one or more devices at the same time. Dubbed “Wireless Charging 2.0,” the semiconductor solutions built with the magnetic resonance technology will also have unique advantages over current technology, including being able to efficiently charge metal-body smartphones, tablets, and smartwatches.

The contemplated semiconductor offerings include designs that comply with the AirFuel™ magnetic resonance specification as well as multi-mode solutions that incorporate both resonant and inductive charging. The AirFuel Alliance, a global organization dedicated to delivering the best wireless-charging experience for consumer electronics, is driving an interoperable ecosystem of wireless-charging Power Transfer Transmit Units (PTUs) and Power Receive Units (PRUs) that enable users to charge their devices everywhere; in their homes and offices to public spaces and even in their vehicles.

Beyond the consumer market, WiTricity is the global technology leader in wireless power for automotive, industrial and medical applications. ST and WiTricity demonstrated high-power wireless-transfer technology for electric vehicle charging at APEC 2016 in Long Beach California. For the automotive industry, WiTricity recently announced wireless “park-and-charge” development kits using their industry-leading 11kW solution for electric- and hybrid-vehicle charging. The solution has successfully been tested by the Society of Automotive Engineers (SAE) for inclusion in a new global standard.

“Combining the expertise of WiTricity, the innovator in wireless power-transfer and magnetic resonance technology with ST’s resources and key IP, including Smart Power technologies and RF Bluetooth low energy, allows us to deliver complete, efficient wireless-charging solutions that increase convenience and ease of use while delighting consumers and exceeding their expectations,” said Matteo Lo Presti, Vice President and General Manager, Analog, in the Analog and MEMS Group, STMicroelectronics. “Game-changing technology from this ST and WiTricity collaboration will enable product designers across the globe to rid the world of cumbersome wires and charging cables and allow us to promote a broader set of our own semiconductor offerings into these emerging markets.”

“STMicroelectronics is a global leader in semiconductor solutions for power electronics and a compelling choice to rapidly commercialize fast and efficient wireless-charging chipsets based on WiTricity’s silicon designs and magnetic-resonance technology,” said Alex Gruzen, CEO of WiTricity. “With ST’s vast experience in semiconductor design and fabrication, as well as its access to leaders in the consumer electronics, automotive, and industrial markets, this collaboration puts us in a strong position to accelerate the adoption of resonance-enabled wireless charging.”

Telit and Intel Collaborate on Joint-Architecture for Intel IoT Platforms for the Industrial Internet of Things

Newly-published product brief illustrates a faster, simpler way to turn edge data into a business asset

Telit, a global enabler of the Internet of Things (IoT), announced it has collaborated with Intel® on a joint-architecture for multiple Intel IoT developer platforms for the Industrial Internet of Things. The commercially available Intel IoT platform consists of end-to-end reference architectures and products with Telit deviceWISE edge-intelligence technology, which includes extensive device driver libraries and built-in Cloud-readiness – giving companies an instant onramp to the Industrial IoT.

The collaboration between Telit and Intel provides far-reaching benefits for remote machine monitoring and control, production diagnostics and predictive maintenance across all markets and industries worldwide. Businesses deploying Intel IoT Platform Technology solutions can quickly establish and future-proof their IoT strategy, connect legacy and new systems, help data flow securely between edge devices and the cloud, and save money for years to come. With support for multiple operating systems and processor performance levels, solutions based on Intel IoT Gateway Technology with deviceWISE are scalable and able to meet needs for a broad range of applications.

“Earlier this year, Telit announced the formation of its Industrial IoT business unit and our collaboration with Intel has created a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO, Telit IoT Platforms. “Intel has adopted the widely-deployed deviceWISE platform architecture for its superior edge intelligence, cloud-ready connectivity and seamless integration into enterprise systems.”

“The ecosystem is critical to the Intel IoT strategy,” said Doug Davis, senior vice president of Internet of Things Group at Intel. “Collaborations with companies like Telit enable Intel to provide key IoT building blocks for our customers to easily scale and drive growth for their IoT solutions.”

Intel and Telit jointly published a product brief “A Faster, Simpler Way to Turn Edge Data into a Business Asset,” illustrating how deviceWISE can turn any Intel IoT development platform into an onramp for the industrial Internet of Things by leveraging these powerful advantages:

  1. Performance at the Edge that enables near real-time analytics, local decision-making, and tighter process controls.

  2. Advanced Data Security and Protection from Costly Attacks

  3. Scalability for varying levels of gateway performance requirements.

  4. Manageability for secure remote upgrades and services.

  5. Faster, More Flexible Deployment with a platform that supports your choice of operating systems and ecosystem applications, enabling faster time to market.

Intel is a featured partner of our deviceWISE Ready program. Our comprehensive certification process assures customers that the Intel IoT Platform has been engineered and tested for simple, quick, and reliable integration with the deviceWISE IoT Platform and is fully supported and endorsed by Telit. View the step-by-step guide to employing the Telit deviceWISE Application Enablement Platform on Intel IoT Architecture.

Telit and Intel Collaborate on Joint-Architecture for Intel IoT Platforms for the Industrial Internet of Things

Newly-published product brief illustrates a faster, simpler way to turn edge data into a business asset

Telit, a global enabler of the Internet of Things (IoT), announced it has collaborated with Intel® on a joint-architecture for multiple Intel IoT developer platforms for the Industrial Internet of Things. The commercially available Intel IoT platform consists of end-to-end reference architectures and products with Telit deviceWISE edge-intelligence technology, which includes extensive device driver libraries and built-in Cloud-readiness – giving companies an instant onramp to the Industrial IoT.

The collaboration between Telit and Intel provides far-reaching benefits for remote machine monitoring and control, production diagnostics and predictive maintenance across all markets and industries worldwide. Businesses deploying Intel IoT Platform Technology solutions can quickly establish and future-proof their IoT strategy, connect legacy and new systems, help data flow securely between edge devices and the cloud, and save money for years to come. With support for multiple operating systems and processor performance levels, solutions based on Intel IoT Gateway Technology with deviceWISE are scalable and able to meet needs for a broad range of applications.

“Earlier this year, Telit announced the formation of its Industrial IoT business unit and our collaboration with Intel has created a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO, Telit IoT Platforms. “Intel has adopted the widely-deployed deviceWISE platform architecture for its superior edge intelligence, cloud-ready connectivity and seamless integration into enterprise systems.”

“The ecosystem is critical to the Intel IoT strategy,” said Doug Davis, senior vice president of Internet of Things Group at Intel. “Collaborations with companies like Telit enable Intel to provide key IoT building blocks for our customers to easily scale and drive growth for their IoT solutions.”

Intel and Telit jointly published a product brief “A Faster, Simpler Way to Turn Edge Data into a Business Asset,” illustrating how deviceWISE can turn any Intel IoT development platform into an onramp for the industrial Internet of Things by leveraging these powerful advantages:

  1. Performance at the Edge that enables near real-time analytics, local decision-making, and tighter process controls.
  2. Advanced Data Security and Protection from Costly Attacks
  3. Scalability for varying levels of gateway performance requirements.
  4. Manageability for secure remote upgrades and services.
  5. Faster, More Flexible Deployment with a platform that supports your choice of operating systems and ecosystem applications, enabling faster time to market.

Intel is a featured partner of our deviceWISE Ready program. Our comprehensive certification process assures customers that the Intel IoT Platform has been engineered and tested for simple, quick, and reliable integration with the deviceWISE IoT Platform and is fully supported and endorsed by Telit. View the step-by-step guide to employing the Telit deviceWISE Application Enablement Platform on Intel IoT Architecture.

STMicroelectronics Empowers Wireless IoT-Device Developers with New LoRa™ Kit Leveraging STM32 Microcontroller Ecosystem

STMicroelectronics has introduced a low-cost development kit that leverages the STM32 microcontroller ecosystem for prototyping Internet-of-Things (IoT) devices with LoRa™ Wireless Low-Power Wide Area Network (LPWAN) connectivity.

Priced at just $40, the P-NUCLEO-LRWAN1 kit combines the ultra-low-power STM32L073 Nucleo (NUCLEO-L073RZ) microcontroller board with an RF expansion board based on the proven SX1272 LoRa transceiver from Semtech (I-NUCLEO-SX1272D). The STM32L073 MCU, with its energy-efficient ARM® Cortex®-M0+ core and proprietary ultra-low-power features, provides an ideal host for devices such as utility meters, alarm systems, positioning devices, trackers, and remote sensors. Users can further extend functionality by adding extra expansion boards, such as the X-NUCLEO-IKS01A1 sensor board for motion, humidity, and temperature sensing.

LoRa enables long-range communication with several advantages over conventional cellular connections, including lower power and cost. Versatile features include multiple communication modes, accurate indoor and outdoor location awareness, and native AES-128 security.

The new kit contains everything needed to build bi-directional end devices that comply with LoRaWAN™ version 1.0.1 and support class A and class C protocols. Devices can be activated using Over-The-Air Activation (OTAA) or Activation-By-Personalization (ABP). An application for LoRaWAN certification tests is included in the kit, and the I-CUBE-LRWAN LoRaWAN stack is available and posted at www.st.com/i-cube-lrwan.

Access to the STM32 ecosystem provides rich development resources, including STM32Cube tools and software packages containing sample code and Hardware Abstraction Layers (HALs). These allow porting to any of the almost 700 STM32 MCU variants that cover a wide range of performance, power, packages, and price points. Developers are also free to use familiar IDEs and ARM mbed™ online tools.

The low purchase price of the P-NUCLEO-LRWAN1 kit allows a wide variety of engineers including independent designers, universities, and hobbyists to enjoy a high-end LoRa development experience. It is available immediately and can be purchased directly from st.com or through distributors.

For further information please visit www.st.com/stm32-lrwan

Telit Announces Cloud-Based Event Video Recording via OzVision Management Platform

Powerful new capability adds real-time videoto Telit’s deviceWISE platform for a complete IoT solution from connected devices such as cameras and sensors

Telit, a global enabler of the Internet of Things (IoT), today announced cloud-based event video recording via the OzVision Management Platform. This powerful new capability adds real-time video to Telit’s deviceWISE platform for a complete IoT solution from connected devices such as cameras and sensors.The OzVision system records, analyzes and distributes massive amounts of real-time data, every day, from over a million cameras worldwide.

“There are times when real-time video is critical in creating true understanding of what is happening in remote and mobile locations”, said Alon Segal, Telit CTO. “Video, integrated in an IoT solution has the unprecedented power to inform, provide convincing evidenceand provide peace of mind.”

For the automotive market, dashboard cameras will now be able to automatically capture and transmit video uponan event trigger. An alert, along with up to 30 seconds of video can be sent to company managers or family members. Fleet managers and direct supervisors can activate preset triggers when harsh braking, excessive speeding or when sensing unauthorized and after-business-hours vehicle use– and then watch a live video stream.

Security applications include fixed surveillance cameras with motion detection capability. Each time the system senses movement, it will send a video clip that starts a few seconds before motion is spotted — and continue transmitting as long it perceives an interloper. The OzVision server is also capable of integrating with third-party analytics services via its OZ INTEGRATE module.At any time, users can view a live video feed.

“The OzVision video cloud platform performs with 99.99% uptime and is a proven provider of plug and play, live view, continuous and event recording, playback and notification services, said Duby Hodd, OzVision CEO. “We offer complete integration with the deviceWISE platform with a sophisticated set of API’s to ensure rapid IoT deployment.”

Telit collaborates with an ever-expanding network of recognized experts and innovators from the M2M/IoT community around the world. Telit’s Business Partners include leading technology and product developers, system integrators and telecom carriers – offering customers hardware and software, integration services and support, wireless network services, custom point solutions and applications, or turnkey commercial deployments, as needed. The thriving deviceWISE community centers on the deviceWISE Ready program. deviceWISE Ready promotes interoperability between products and services from our Business Partners and the deviceWISE AEP, thus reducing the risk, time-to-market, complexity and cost of deploying complete end-to-end IoT solutions.

See a live demonstration of the OzVision system integrated with Telit’s deviceWISE platform atthe CTIA Super Mobility Conference in Las Vegas at the Telit exhibit booth #4832.One day prior to CTIA at Telit’s IoT Innovation expoat Caesars Palace,the OzVision demo remote controlled car will be test drivenby Telit IoT Platforms CEO, Fred Yentz.

Telit Announces Rapid IoT Development Kit with Built-in Cellular Connectivity and Cloud-based IoT Portal Integration

Full-featured kit for standalone prototyping or as cellular plug-in for popular Maker platforms

Telit, a global enabler of the Internet of Things (IoT), today announced a Rapid IoT Development Kit with built-in cellular connectivity and seamless integration with the Cloud-based Telit IoT Portal – reducing IoT solution prototyping from weeks or months to mere hours. The comprehensive kit can be used to develop standalone IoT prototypes or as a convenient cellular, Cloud-ready plug-in for popular open Maker platforms. The intuitive IoT Portal lets users connect and manage the kit, and makes it easy to securely extract and consume data by using built-in dashboards, designing web-based and mobile apps, and integrating with enterprise systems for big data analytics.

“Telit and the Texas Instruments (TI) LaunchPad™ development kits are a powerful combination for any developer looking to prototype a robust and complete IoT solution,” said Adrian Fernandez, Microcontroller Development Experience Manager, TI. “Developers can simply snap a TI LaunchPad development board onto the Telit Rapid IoT Development Kit for virtually instant cellular connectivity and integration with a cloud-based IoT platform to collect, manage and analyze your data.”

The Rapid IoT Development Kit operates in both standalone mode and interface mode. As a standalone device, it operates solely with the unique on-board processing power of the Telit xe910 module based upon the AppZone C development and runtime environment. There is a variety of sensors already on the board including accelerometer, temperature and LED indicators. In interface mode, the on-board headers enable quick plug and play stacked integration with the most popular open Maker platforms such as Raspberry Pi, TI LaunchPad, and Arduino – all free of connecting cables.

“Our new Rapid IoT Development Kit redefines IoT prototyping, allowing development engineers, system integrators and the Maker community to conceive end-to-end solutions – from sensor to app, using a complete, pre-integrated set of hardware, cellular connectivity and Cloud-services,” said John Keever, CTO Telit IoT Platforms. “All of the necessary resources and tools are there and our goal is to have users connected and active within minutes.”

See live demonstrations of the Rapid IoT Development Kit at the CTIA Super Mobility Conference in Las Vegas at the Telit exhibit booth #4832.

Telit and Tech Mahindra Collaborate on Enabling End-To-End IoT Solutions

Multi-faceted relationship spans turnkey solutions, system integration, global business development, and engineering services

Telit, a global enabler of the Internet of Things (IoT), today announced its multi-faceted collaboration with Tech Mahindra on developing complete solutions for the Internet of Things (IoT). The relationship is centered on combining and integrating Telit’s leading portfolio of IoT products and services with Tech Mahindra’s unmatched system integration expertise and strengths in developing end-to-end enterprise solutions. Both companies are also jointly pursuing new business opportunities across many markets and industries, such as IoT horizontal and Industrial IoT around the world. Additionally, Telit has reached an agreement to outsource related engineering development and testing activities to Tech Mahindra.

As a fast-growing number of companies is exploring how the IoT can help them improve operational efficiencies and drive new business models, many – especially large multinational enterprises – remain intimidated by having to put all the pieces together by themselves. Telit and Tech Mahindra are jointly addressing these concerns by offering clients complete end-to-end solutions such as IoT solution consulting, solution development and operations that reduce the complexity, risk, cost and time-to-market versus trying to develop a custom project in house. Under its vast system integration and IT consultancy services, Tech Mahindra’s IoT experts have been fully trained and certified in designing end-to-end solutions around Telit IoT modules, connectivity and Cloud-based platforms.

“Tech Mahindra and Telit are each strategically focused on capitalizing on the exponential growth across many IoT verticals and together we are positioned to grow at a pace greater than or equal to the industry, “ said Karthikeyan Natarajan, senior vice president & global head of engineering services at Tech Mahindra. “This collaboration will address the broad IoT solutions with particular emphasis on the industrial internet and Industry 4.0 programs of our manufacturing customers across Automotive, Aerospace, Medical, discrete and hi-tech manufacturing verticals,“

“Telit is very excited about this collaboration with Tech Mahindra, resulting in far-reaching technical and business synergies that offer a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO of Telit IoT Platforms. “Together we can help organizations transform their business with end-to-end IoT solutions – from ideation generation, to system architecture, proof of concept development and full commercial deployments that are integrated with their existing enterprise systems.”

Telit and Tech Mahindra each have deep expertise working with companies large and small that rely on mission-critical performance, security and scalability. Today, both companies are already engaged in several industrial customer projects together, including a leading global heavy equipment company. Their joint capabilities can be easily applied to any company seeking to transform its business model with IoT enabled real-time remote machine monitoring and control, production diagnostics, predictive maintenance, or asset tracking solutions.

Telit India and WE Components India announce strategic alliance

WE Components to support Telit’s growth in the Internet of Things (IoT) by becoming a distributor and engineering design partner

Telit, a global enabler of the Internet of Things (IoT), today announced a strategic alliance with WE Components India. As part of this alliance, WE Components becomes a Telit distributor and design development partner in India. WE Components India, which has a presence across APAC and India,will play a key role in developing new business in the IoT domain by utilizing their in-house design expertise which spans across different applications.

The company, which is principally engaged in the distribution of active, passive, electromechanical components and connectors and value-added services in engineering designs and vendor-managed inventory (“VMI”), will also support Telit by offering value-added services like design fulfillment and logistics support. With its high-tech APAC and India infrastructure facility,WE Components is equipped to support Telit’s current market needs and diversification plans.

Mr. Ashish Gulati, Country Manager Telit India added, “We are pleased to welcome WE Components as our authorized distributor and design partner for IoT applications. Their specialization in this domain coupled with their APAC and India presence makes them an ideal partner for Telit.”

According to Mr.Sriram Krishna, Country Manager/Director WE Components India, “WE look forward to this win-win alliance with Telit. With our strong technical marketing team and presence across India, WE is able to support Telit’s wide range of products and solutions. The combination of WE Components and Telit’s expertise and offerings will enable customers to achieve compliance across IoT applications.”

AT&T and Otis Collaborate on IoT Solutions

Enhance Connectivity of Next Generation Elevators and World’s Largest Elevator Service Network

Today AT&T (NYSE:T) and Otis Elevator Company, a unit of United Technologies Corp. (NYSE:UTX), announced they are collaborating on opportunities to enhance connectivity through the use of Internet of Things (IoT) products – services and technologies that employ digital technologies to better connect with customers and with elevator, escalator and moving walkway equipment.

As part of this collaboration, AT&T* and Otis Elevator Company (Otis) are expanding their long-standing relationship to develop the connectivity to support advanced elevators while also providing mobility to more than 30,000 service employees at Otis companies worldwide.

Otis companies around the world will use AT&T IoT technology to aggregate data from cell networks and connect to a new enhanced cloud environment. AT&T’s Global SIM card and IoT Services, such as Control Center, M2X and Flow Designer, will also allow Otis to access real-time equipment performance data. In addition, AT&T will serve as the primary mobility provider for Otis field operations.

This collaboration is one example of how AT&T and United Technologies are exploring ways to harness the power of digital technologies and communications networks to improve performance, lower costs and deliver better results for customers in building systems and aerospace.

“We strongly believe that a new generation of elevators will be defined by new digital tools that better connect our people with our customers – and our customers with their equipment,” said Otis President Philippe Delpech. “We will also develop new responsive service solutions that give Otis employees more autonomy and Otis customers more control over their equipment and buildings by leveraging the AT&T IoT technology to harness data generated by the nearly 2 million elevators currently under Otis service contract transporting over 2 billion people per day.”

For more than 15 years, Otis has used AT&T Network Services in its commercial business. This agreement will provide new mobility tools that put more information in the hands of Otis’ customer-facing employees and provide Otis customers enhanced efficiency, communication and flexibility.

Experts at AT&T will help Otis accelerate efforts to create buildings with more seamless security and transportation systems that are invisible to the tenant or resident and are more efficient and reduce building energy use.

“We’re seeing more global businesses use IoT technologies to take their business to the next level. They’re extracting actionable information from their machines, equipment, factories, fleet vehicles and more,” said Chris Penrose, senior vice president, IoT Solutions, AT&T. “The fact that Otis is extending their relationship with AT&T to include IoT services shows they’re innovative thinkers. They understand how it can change the way they operate and interact with their customers.”

To learn more about IoT’s potential to transform business, visit www.att.com/iot and download the AT&T IoT Insights Report here.

For more information on UTC Products, visit http://www.utc.com.

For more information on Otis elevators, visit http://www.otisworldwide.com.

*AT&T products and services are provided or offered by subsidiaries and affiliates of AT&T Inc. under the AT&T brand and not by AT&T Inc.