Telit Unveils Bluetooth 5 Module at Mobile World Congress 2017

Telit, a global enabler of the Internet of Things (IoT), today introduced the Bluetooth Low Energy (BLE) BlueMod+S50 single mode module. This marks the industry’s first introduction of a standalone and certified, Bluetooth® 5 compliant module with a compelling mix of future-proof features designed to extend product lifecycles. Building on the success of the Telit BlueMod family of Bluetooth modules and complete integrated set of IoT Products and services, the BlueMod+S50 is key to bringing low power, “connectionless” IoT designs and services to market quickly.

The new BlueMod+S50 module from Telit marks an industry milestone. Now, developers can adopt this cutting-edge technology into use cases not possible with previous generations of Bluetooth, such as full in-building connections. The latest Bluetooth 5 specification offers significant updates with quadruple range and speeds that are twice as fast, while increasing the capacity of connectionless data broadcasts by 800%. Always a step ahead, Telit incorporated additional features such as secure, integrated NFC (Near Field Communication) capability and support for most GATT based Client and Server profiles.

“What makes the BlueMod+S50 so compelling is the combination of industry’s latest silicon with Telit’s state of the art engineering for an overall richer, more intelligent user experience,” said Felix Marchal, Executive Vice President of GNSS and Short Range Wireless. “We take it a step further with our ‘design once, use anywhere’ philosophy by including resources from the Telit IoT Know How program—assisting customers holistically with deployment of completion solutions from idea to market. The new module is not only swappable with previous generations of our Bluetooth line, it includes enhancements that benefit verticals which depend on advanced, forward-thinking technology like smart home and healthcare.”

Key Features and Benefits:
· Generic GATT Client and Server: Simplifies configuration
· Terminal I/O: Enables fast and reliable transport of data/ protocols transparently over Bluetooth
· NFC Handover: Eliminates manual interaction, delivering a nearly instant and most important—secure connection.
· Reliable line-of-sight range: over 800* meters. (*250m with Android phone and iPhone).
· Ultra-Low power: Proprietary UICP (UART Interface Control Protocol) further reduces power consumption of the module by 30-100 times compared to non UICP operations.

The BlueMod+S50 delivers industry-leading low power consumption and is well suited for many verticals including home automation, healthcare, telematics, asset management, routers and gateways, retail, and smart cities in addition to battery dependent devices with long product lifecycles. Designers can integrate the module without additional hardware via a robust choice of interfaces, including GPIO, ADC, UART, SPI, and others.

The new module is being fast tracked to address market demand for advanced, low-power wireless networking technology. It is the company’s latest addition to the Advanced Edge Technology portfolio that supports Bluetooth, Short range, GNSS, Wi-Fi, LoRa, and LPWA. As device makers are looking to develop IoT solutions that remain relevant for years to come, they are eager to adopt future-proof solutions. ABI Research forecasts Bluetooth-enabled device shipments over the next five years will increase by an average of half a billion per year through 2021, reaching more than five billion.

Learn more about the new BlueMod+S50 module in Telit’s booth at Mobile World Congress 2017, located at hall 5 stand E61 and also at http://info.telit.com/bluemods50.

* Samples, evaluation and development kits available in the second half of 2017.

Versatile Accelerometer from STMicroelectronics Delivers Class-Leading Resolution and Low Power in Tiny Footprint

Taking context sensing in Internet-of-Things (IoT) and wearable devices to the next level, STMicroelectronics’ LIS2DW12 3-axis accelerometer delivers superior accuracy, flexibility, and energy savings by supporting multiple low-power and low-noise settings in a 2mm x 2mm x 0.7mm package.

A new member of ST’s low-power, high-performance MEMS product family (alongside devices like LSM6DSM, LSM6DSL, and LSM303AH), the LIS2DW12 has 16-bit output and can be set to prioritize low power consumption or low-noise performance, with five settings in either mode. A specific feature coupled with four settings in each mode save waking the system to check for data, and allow efficient single-byte transfers thereby further minimizing system power consumption and helping extend battery life. Noise density down to 90µg/√Hz is at least 25% lower than similar devices in the marketplace, which improves the measurement accuracy in next-gen applications from healthcare, fitness, and gaming to industrial sensing and environmental monitoring.

Drawing as little as 50nA in standby, or 380nA in low-power mode at 1.6Hz Output Data Rate, the LIS2DW12 adds negligible load on the battery. The supply-voltage range of 1.62-3.6V allows extended operation from small coin or button cells. Features that support system-level power savings include a 32-level FIFO, a built-in temperature sensor, and a programmable interrupt for freefall, wake up, activity/inactivity, 6D/4D orientation detection, and tap/double-tap detection.

The LIS2DW12 offers high resolution and flexibility to optimize noise performance and power consumption in a small 2mm x 2mm x 0.7mm package.

Engineering samples of the LIS2DW12 are available now, and volume production will begin in Q1 2017. Budgetary pricing is from $0.75 for orders of 1000 pieces.

For further information please visit www.st.com/lis2dw12-pr

Telit adds Wi-Fi and low-power solutions for IoT with acquisition of GainSpan to extend end-to-end IoT solutions reach

Telit, a global enabler of the Internet of Things (IoT), today announced that it has agreed to acquire Silicon Valley-based GainSpan Corporation (“GainSpan”). GainSpan is a wireless connectivity solution provider that specializes in the design and development of ultra-low power Wi-Fi technology. The company manufactures and commercializes chips and modules for battery-powered devices and related intellectual property (IP) with embedded software, including network stacks and application reference designs. GainSpan has over 90 employees, mostly R&D and application and support engineers, spread across an R&D center in Bangalore, India and San Jose, California.

“As we enter an era of maturity for the IoT, we are starting to witness the appearance of spaces within it such as the Internet of Sensors, the Internet of Cars, and the Internet of Digital,” said Oozi Cats, CEO of Telit. “With few exceptions, the ability to cut the power cord is an essential growth engine for all these branches of the IoT.”

According to the September 2016 “IoT Forecasts” from Machina Research, by 2025 about 75% of the more than 27 billion IoT connections will be short range, which is largely comprised of the various types of Wi-Fi. Wi-Fi is a leading technology for applications within the IoT that are battery-dependent, due to the low-power consumption associated with the technology.

The new business addition positions Telit to expand its complete end-to-end IoT solutions portfolio and address the growing market of battery-powered devices that rely on Wi-Fi and other low-power technologies. GainSpan products are situated at the intersection of several emerging segments in IoT such as healthcare, building management, cold-chain logistics, and a wide range of commercial and industrial application areas. GainSpan’s top-tier customer base leverage the company’s IP to deliver seamless integration of Wi-Fi with low-power technologies like BLE and 6LoWPAN for reliable, secure connectivity.

“The acquisition of GainSpan brings to Telit a world-class portfolio and a proven track record of Wi-Fi and low-power module solutions trusted by tier-one customers,” continued Oozi Cats. “Combined with our existing strength in delivering the most comprehensive, relevant portfolio of products and solutions for the IoT, this addition positions us well for future growth in our target segments, including security and surveillance, home automation, healthcare, asset management, and smart cities.”

Assets from GainSpan align well with existing Telit products including cellular, BT/BLE, GNSS modules; IoT connectivity and platform services, strengthening the company’s “sensor-to-cloud” solution proposition. The integration of the unique variety of low-power Wi-Fi technology from GainSpan, with low standby current and fast wake-up time into the Telit portfolio enables customers to extend the battery life of their devices for years*. GainSpan IP also offloads Wi-Fi services and networking functionality from the application. Customer devices can be designed with a simple and inexpensive MCU or without one at all.

Low-Power, Long-Range Radio Chip from STMicroelectronics Extends the Reach of the IoT, Adds Support for Sigfox Global Network

v Ultra-low-power design for prolonged battery lifetime in applications with sensors in the Smart Home, Smart City, and Smart Industry

v Built-in support for Sigfox simplifies access to reliable, efficient, and cost-effective IoT connectivity

v Programmable device supports multiple protocols and multiple sub-1GHz Industrial, Scientific and Medical (ISM) frequency bands

The latest radio chip for the Internet-of-Things (IoT) from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, delivers extremely high energy efficiency for smart connected objects to operate for up to 10 years without replacing batteries.

ST’s new S2-LP transceiver is ideal for networked devices, such as alarm systems, surveillance equipment and smart energy-metering solutions, as well as long-range radio links used to connect devices like remote sensors directly to the Cloud without a local gateway. Other applications include building automation, industrial monitoring and control, and systems for managing lighting, traffic, or parking in smart cities.

The device operates in unlicensed sub-1GHz frequency bands, which are available globally. Ultra-narrowband operation allows highly efficient use of radio spectrum and reliable data exchange up to long distances using low-power signals.

In addition, the transceiver enables connectivity to the Sigfox global network, which is being rolled out worldwide to provide a reliable cost- and energy-efficient communication solution for billions of sensors and smart things.

“Building on our strengths in MEMS Sensors, Analog and Microcontrollers, in 2009 we saw the coming need to support emerging IoT applications with a low-power ISM radio for medium-long-range wireless connections and we developed and introduced our own SPIRIT1 low-power sub-1GHz radio that is currently in many applications available in the market,” said Benedetto Vigna, Executive Vice President, General Manager, Analog and MEMS Group, STMicroelectronics. “Now, in partnership with Sigfox, we are opening a new era in ISM radios for the IoT to extend battery life from months to more than 10 years while preserving the robustness and reliability of the connection and reducing maintenance costs for remote and difficult-to-reach sensors.”

Tony Francesca, Vice President of Global Ecosystem Partners at Sigfox added, “Our global network, which has been optimized for the lowest device energy consumption and cost, provides an entirely new way of connecting the physical world to the Cloud. ST’s support for Sigfox, integrated in the new S2-LP radio device, will help system designers bring their IoT concepts to life by leveraging the benefits of our fast global infrastructure and ecosystem.”
The S2-LP long-range, low-data-rate transceiver is in production now in a 4mm x 4mm QFN24 package, priced $1.15 for orders of 1000 pieces.

Technical Notes

The S2-LP transceiver is a highly integrated device made possible by ST’s wide-ranging competencies including low-power RF analog design and integration with digital blocks comprising the radio baseband. It:
· Supports point-to-point, star, as well as mesh networking topologies thus resulting in a very flexible wireless transceiver for connected objects.

· Delivers extremely low power consumption, drawing only 6.7mA in receive mode, and 10mA when transmitting at 10dBm. Sleep and standby modes reduce the current to just 600nA and 350nA, respectively.

· Receiver sensitivity of -130dBm enables operation over distances up to several hundred kilometers, depending on the environment, thus enabling wide-area coverage.

· Is a flexible solution that can be programmed for operation in multiple worldwide sub-1GHz ISM frequency band: support for Sigfox, Wireless M-Bus and 6LowPAN, as well as IEEE 802.15.4g, which is suitable for home energy-management systems.

· Leverages a full-featured Software Development Kit (SDK) compatible with the STM32 microcontroller family that has proven credentials in the energy-conscious IoT space, and with the extensive STM32 development ecosystem including prototype boards and rich software tools and resources.

· Is Sigfox-ready and comes with a pre-certified Development Kit enabling immediate connectivity to the Sigfox network for evaluation and easy prototyping purposes.

Telit launches its Advanced Internet of Things (IoT) Modules for the India market

Telit Communications PLC (AIM:TCM), a global enabler of the Internet of Things (IoT), announced the launch of its advanced portfolio of LTE Cat.1 (IoT) modules in India. The CAT-1 module series serves customers requiring a mid-speed, low-power, long life-cycle mobile data solution for new or existing cellular-connected devices.

With Telit’s flagship LTE CAT-1 modules the Telecom providers in India would find it much easier to embrace the IoT revolution. These modules would help customers solve their wireless needs as they move their IoT solutions from 2G to 4G LTE networks. It helps deliver network based solutions with cost savings and longevity to bring today’s IoT products in to the future.

Mr. KyungJun Lee, Senior Director Marketing Telit APAC said, “Telit is a global leader in IoT technologies and offers the widest spectrum of IoT communication modules, IoT Connectivity and IoT Platform in the industry. The application of IoT in various fields within India has seen innumerable benefits for both the service providers and customers. These have been achieved at a minimal cost coupled with greater efficiency improvement. Our LTE CAT-1 modules have been a solution for all the Telecom operators globally and this we are sure would benefit Indian operators as well.”

Mr. Ashish Gulati, Country Head India added, “Telit solutions are well tailored to suit India market offering highest standards of performance at the most competitive cost that makes it a unique combination in the field of IoT technology globally. As Indian operators deploy LTE networks, our LTE CAT-1 modules would equip Indian telecom providers not only in embracing the IoT revolution faster but also in a cost effective manner”

Telit IoT Portal-ready modules powered by deviceWISE, make device onboarding simple to program, maintain and scale. All of Telit’s LE910 CAT-1 modules are Telit IoT Portal ready, supporting high-level commands specifically designed to provide quick and hassle-free onboarding of device and data to the cloud, customer apps, back-end systems and servers.

Telit Introduces World’s First Hybrid IoT Modules Combining 3G Cellular, Wi-Fi, Bluetooth and GNSS into a Single Package

IoT Cloud-ready, smart modules feature exclusive Intel® Atom™ x3 SoC Processor technology

Telit, a global enabler of the Internet of Things (IoT), today announced global commercial availability of the world’s first hybrid IoT modules that combine 3G Cellular, Wi-Fi, Bluetooth and GNSS into a single package. The new HE922-3GR and WE922-3GR smart module series in the xE922 family are also the first to use the Intel® Atom™ x3 SoC Processor technology with a self-contained quad-core processing engine and comprehensive I/O resources. Combined with the company IoT Portal and IoT Connectivity services, these modules deliver a complete end-to-end solution ideal for providers in a broad range of application areas including healthcare, vending, POS, public parking, smart buildings, smart grid and the industrial internet of things.

“The xE922-3GR products are game changers. When you look at how complexity of designing devices with multiple chipsets is impacting cost and time-to market, you can appreciate the power of these all-in-one hybrid modules,” said Ronen Ben-Hamou, Telit Executive Vice President of Products and Solutions. “It would take a good engineering team months to develop an IoT device prototype using disparate chips, whereas an engineer or two can now create a complete end-to-end IoT solution in just couple of weeks.”

“Across all industries and segments, businesses are always looking for shortcuts in traditional product development to get to market faster.” said Fred Yentz, Chief Executive Officer, Telit IoT Platforms. “With the combination of Telit’s Cloud-ready IoT modules, custom data plans, comprehensive IoT Portal, and unmatched IoT Know-How, we make it easy to connect, manage and integrate your ‘things’ with web-based or mobile apps or enterprise systems – providing the fastest path to business transformation, improved operational efficiencies and innovation in the market.”

Technical Specifications:
With a 34x40mm LGA footprint, the WE922-3GR and HE922-3GR deliver unparalleled features for their size. Both modules include 2.4GHz Wi-Fi 802.11 b/g/n and Bluetooth 4.0 LE. The embedded global positioning receiver in the modules is compatible with GPS and GNSS constellations. Both of them integrate the functionality of an entire processor board inside the 441-pin package based on the 1.2GHz, 64-bit, quad-core Intel® Atom™ x3 processor series and include 8GB memory, sensor inputs, battery charger logic, analog speaker and microphone audio connections, interface for primary and secondary cameras and direct support for high-resolution display with touch screen and/or keyboard. The application development environment is based on Android and Yocto Linux enabling access and reuse of vast libraries of functions and applications across all industries and segments. In addition to all of the above features, the HE922-3GR includes quad-band HSPA+ cellular connectivity delivering 21Mbps download data rate with fallback to 2G. The 3GPP Release 7 compliant HE922-3GR module supports 850/900/1900/2100MHz 3G HSPA+ bands with 850/900/1800/1900MHz 2G. The upload data rate is 5.76Mbps.

Both the WE922-3GR and HE922-3GR modules are available in two environmental grade variants. The commercial grade has an operating temperature range of 0°C to +70°C; the extended grade has an operating temperature range of -40°C to +85°C. The modules can be connected to an SD card and provide connections for a USB 2.0 port with OTG, two UART and SPI ports and I2C support.

A developers’ kit is also available for the modules which includes a high-resolution touch screen with embedded cameras and audio, all the necessary antennas and a power supply. A comprehensive set of application development tools is available online.

STMicroelectronics and WiTricity to Develop Integrated Circuits (ICs) for Resonant Wireless Power Transfer

• Chips to accelerate the adoption of wireless charging, with ability to efficiently charge metal-body consumer electronics
• Opportunities include consumer electronics, Internet of Things, mobile computing, automotive, medical, and industrial applications

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and WiTricity, the industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer. The goal is to “cut the last cord,” bringing convenience to the powering and charging of consumer electronics, Internet of Things (IoT) devices, as well as medical, industrial, and automotive applications.

WiTricity and ST are developing semiconductor solutions that combine WiTricity’s foundational intellectual property and wireless power-transfer mixed-signal IC-design expertise, with ST’s leadership in power-semiconductor design, fabrication, and packaging capabilities and resources. For the consumer electronics and IoT markets, power transmit and receive systems built with these new semiconductors aim to deliver spatial freedom, as well as wireless fast charging of one or more devices at the same time. Dubbed “Wireless Charging 2.0,” the semiconductor solutions built with the magnetic resonance technology will also have unique advantages over current technology, including being able to efficiently charge metal-body smartphones, tablets, and smartwatches.

The contemplated semiconductor offerings include designs that comply with the AirFuel™ magnetic resonance specification as well as multi-mode solutions that incorporate both resonant and inductive charging. The AirFuel Alliance, a global organization dedicated to delivering the best wireless-charging experience for consumer electronics, is driving an interoperable ecosystem of wireless-charging Power Transfer Transmit Units (PTUs) and Power Receive Units (PRUs) that enable users to charge their devices everywhere; in their homes and offices to public spaces and even in their vehicles.

Beyond the consumer market, WiTricity is the global technology leader in wireless power for automotive, industrial and medical applications. ST and WiTricity demonstrated high-power wireless-transfer technology for electric vehicle charging at APEC 2016 in Long Beach California. For the automotive industry, WiTricity recently announced wireless “park-and-charge” development kits using their industry-leading 11kW solution for electric- and hybrid-vehicle charging. The solution has successfully been tested by the Society of Automotive Engineers (SAE) for inclusion in a new global standard.

“Combining the expertise of WiTricity, the innovator in wireless power-transfer and magnetic resonance technology with ST’s resources and key IP, including Smart Power technologies and RF Bluetooth low energy, allows us to deliver complete, efficient wireless-charging solutions that increase convenience and ease of use while delighting consumers and exceeding their expectations,” said Matteo Lo Presti, Vice President and General Manager, Analog, in the Analog and MEMS Group, STMicroelectronics. “Game-changing technology from this ST and WiTricity collaboration will enable product designers across the globe to rid the world of cumbersome wires and charging cables and allow us to promote a broader set of our own semiconductor offerings into these emerging markets.”

“STMicroelectronics is a global leader in semiconductor solutions for power electronics and a compelling choice to rapidly commercialize fast and efficient wireless-charging chipsets based on WiTricity’s silicon designs and magnetic-resonance technology,” said Alex Gruzen, CEO of WiTricity. “With ST’s vast experience in semiconductor design and fabrication, as well as its access to leaders in the consumer electronics, automotive, and industrial markets, this collaboration puts us in a strong position to accelerate the adoption of resonance-enabled wireless charging.”

Telit and Intel Collaborate on Joint-Architecture for Intel IoT Platforms for the Industrial Internet of Things

Newly-published product brief illustrates a faster, simpler way to turn edge data into a business asset

Telit, a global enabler of the Internet of Things (IoT), announced it has collaborated with Intel® on a joint-architecture for multiple Intel IoT developer platforms for the Industrial Internet of Things. The commercially available Intel IoT platform consists of end-to-end reference architectures and products with Telit deviceWISE edge-intelligence technology, which includes extensive device driver libraries and built-in Cloud-readiness – giving companies an instant onramp to the Industrial IoT.

The collaboration between Telit and Intel provides far-reaching benefits for remote machine monitoring and control, production diagnostics and predictive maintenance across all markets and industries worldwide. Businesses deploying Intel IoT Platform Technology solutions can quickly establish and future-proof their IoT strategy, connect legacy and new systems, help data flow securely between edge devices and the cloud, and save money for years to come. With support for multiple operating systems and processor performance levels, solutions based on Intel IoT Gateway Technology with deviceWISE are scalable and able to meet needs for a broad range of applications.

“Earlier this year, Telit announced the formation of its Industrial IoT business unit and our collaboration with Intel has created a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO, Telit IoT Platforms. “Intel has adopted the widely-deployed deviceWISE platform architecture for its superior edge intelligence, cloud-ready connectivity and seamless integration into enterprise systems.”

“The ecosystem is critical to the Intel IoT strategy,” said Doug Davis, senior vice president of Internet of Things Group at Intel. “Collaborations with companies like Telit enable Intel to provide key IoT building blocks for our customers to easily scale and drive growth for their IoT solutions.”

Intel and Telit jointly published a product brief “A Faster, Simpler Way to Turn Edge Data into a Business Asset,” illustrating how deviceWISE can turn any Intel IoT development platform into an onramp for the industrial Internet of Things by leveraging these powerful advantages:

  1. Performance at the Edge that enables near real-time analytics, local decision-making, and tighter process controls.

  2. Advanced Data Security and Protection from Costly Attacks

  3. Scalability for varying levels of gateway performance requirements.

  4. Manageability for secure remote upgrades and services.

  5. Faster, More Flexible Deployment with a platform that supports your choice of operating systems and ecosystem applications, enabling faster time to market.

Intel is a featured partner of our deviceWISE Ready program. Our comprehensive certification process assures customers that the Intel IoT Platform has been engineered and tested for simple, quick, and reliable integration with the deviceWISE IoT Platform and is fully supported and endorsed by Telit. View the step-by-step guide to employing the Telit deviceWISE Application Enablement Platform on Intel IoT Architecture.

Telit and Intel Collaborate on Joint-Architecture for Intel IoT Platforms for the Industrial Internet of Things

Newly-published product brief illustrates a faster, simpler way to turn edge data into a business asset

Telit, a global enabler of the Internet of Things (IoT), announced it has collaborated with Intel® on a joint-architecture for multiple Intel IoT developer platforms for the Industrial Internet of Things. The commercially available Intel IoT platform consists of end-to-end reference architectures and products with Telit deviceWISE edge-intelligence technology, which includes extensive device driver libraries and built-in Cloud-readiness – giving companies an instant onramp to the Industrial IoT.

The collaboration between Telit and Intel provides far-reaching benefits for remote machine monitoring and control, production diagnostics and predictive maintenance across all markets and industries worldwide. Businesses deploying Intel IoT Platform Technology solutions can quickly establish and future-proof their IoT strategy, connect legacy and new systems, help data flow securely between edge devices and the cloud, and save money for years to come. With support for multiple operating systems and processor performance levels, solutions based on Intel IoT Gateway Technology with deviceWISE are scalable and able to meet needs for a broad range of applications.

“Earlier this year, Telit announced the formation of its Industrial IoT business unit and our collaboration with Intel has created a new way for companies to onboard to the Internet of Things,” commented Fred Yentz, CEO, Telit IoT Platforms. “Intel has adopted the widely-deployed deviceWISE platform architecture for its superior edge intelligence, cloud-ready connectivity and seamless integration into enterprise systems.”

“The ecosystem is critical to the Intel IoT strategy,” said Doug Davis, senior vice president of Internet of Things Group at Intel. “Collaborations with companies like Telit enable Intel to provide key IoT building blocks for our customers to easily scale and drive growth for their IoT solutions.”

Intel and Telit jointly published a product brief “A Faster, Simpler Way to Turn Edge Data into a Business Asset,” illustrating how deviceWISE can turn any Intel IoT development platform into an onramp for the industrial Internet of Things by leveraging these powerful advantages:

  1. Performance at the Edge that enables near real-time analytics, local decision-making, and tighter process controls.
  2. Advanced Data Security and Protection from Costly Attacks
  3. Scalability for varying levels of gateway performance requirements.
  4. Manageability for secure remote upgrades and services.
  5. Faster, More Flexible Deployment with a platform that supports your choice of operating systems and ecosystem applications, enabling faster time to market.

Intel is a featured partner of our deviceWISE Ready program. Our comprehensive certification process assures customers that the Intel IoT Platform has been engineered and tested for simple, quick, and reliable integration with the deviceWISE IoT Platform and is fully supported and endorsed by Telit. View the step-by-step guide to employing the Telit deviceWISE Application Enablement Platform on Intel IoT Architecture.

STMicroelectronics Empowers Wireless IoT-Device Developers with New LoRa™ Kit Leveraging STM32 Microcontroller Ecosystem

STMicroelectronics has introduced a low-cost development kit that leverages the STM32 microcontroller ecosystem for prototyping Internet-of-Things (IoT) devices with LoRa™ Wireless Low-Power Wide Area Network (LPWAN) connectivity.

Priced at just $40, the P-NUCLEO-LRWAN1 kit combines the ultra-low-power STM32L073 Nucleo (NUCLEO-L073RZ) microcontroller board with an RF expansion board based on the proven SX1272 LoRa transceiver from Semtech (I-NUCLEO-SX1272D). The STM32L073 MCU, with its energy-efficient ARM® Cortex®-M0+ core and proprietary ultra-low-power features, provides an ideal host for devices such as utility meters, alarm systems, positioning devices, trackers, and remote sensors. Users can further extend functionality by adding extra expansion boards, such as the X-NUCLEO-IKS01A1 sensor board for motion, humidity, and temperature sensing.

LoRa enables long-range communication with several advantages over conventional cellular connections, including lower power and cost. Versatile features include multiple communication modes, accurate indoor and outdoor location awareness, and native AES-128 security.

The new kit contains everything needed to build bi-directional end devices that comply with LoRaWAN™ version 1.0.1 and support class A and class C protocols. Devices can be activated using Over-The-Air Activation (OTAA) or Activation-By-Personalization (ABP). An application for LoRaWAN certification tests is included in the kit, and the I-CUBE-LRWAN LoRaWAN stack is available and posted at www.st.com/i-cube-lrwan.

Access to the STM32 ecosystem provides rich development resources, including STM32Cube tools and software packages containing sample code and Hardware Abstraction Layers (HALs). These allow porting to any of the almost 700 STM32 MCU variants that cover a wide range of performance, power, packages, and price points. Developers are also free to use familiar IDEs and ARM mbed™ online tools.

The low purchase price of the P-NUCLEO-LRWAN1 kit allows a wide variety of engineers including independent designers, universities, and hobbyists to enjoy a high-end LoRa development experience. It is available immediately and can be purchased directly from st.com or through distributors.

For further information please visit www.st.com/stm32-lrwan